Inventor · disambiguated record
Ken Ukawa
Also filed as: UKAWA KEN
3 granted patents·2 pending applications·13 citations·filing 2005–2013
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0170US9136194B2Resin composition for encapsulation and electronic device using the sameSUMITOMO BAKELITE CO·Filed 2013·Granted Sep 15, 2015·3 cites·14 claims
- 0266US7741388B2Epoxy resin composition and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2005·Granted Jun 22, 2010·7 cites·24 claims
- 0361US7671146B2Epoxy resin composition for encapsulating semiconductor and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Granted Mar 2, 2010·3 cites·7 claims
- 0438US2013289187A1Resin composition for encapsulation and electronic component deviceWADA MASAHIRO·Filed 2011·Application pending·0 cites
- 0536US2006228562A1Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulatingUKAWA KEN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →