Inventor · disambiguated record
Kee Ju Um
Also filed as: UM KEE JU
20 granted patents·18 pending applications·182 citations·filing 2011–2024
92Inventor score
Top patents by PatentIndex Score
38 records- 0190USD717255SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·45 cites·1 claims
- 0290USD717254SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·50 cites·1 claims
- 0389USD719113SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 9, 2014·43 cites·1 claims
- 0485USD719926SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 23, 2014·33 cites·1 claims
- 0584US9019735B2Power factor correction circuit and method for controlling power factor correctionSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 28, 2015·6 cites·14 claims
- 0667US9627470B2Power semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 18, 2017·2 cites·25 claims
- 0764US8981423B2Power semiconductor device and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 17, 2015·1 cites·17 claims
- 0862US9318599B2Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 19, 2016·1 cites·11 claims
- 0960US2025168980A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1060US2025024601A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1159US8766581B2Power factor correction circuit, and power supply device and motor driving device having the samePARK MIN GYU·Filed 2011·Granted Jul 1, 2014·1 cites·21 claims
- 1252US11166365B2Printed circuit board and manufacturing method for the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 2, 2021·0 cites·6 claims
- 1350US9318423B2Leadless package type power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 19, 2016·0 cites·10 claims
- 1449US9287363B2Semiconductor device, method of manufacturing the same and power semiconductor device including the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 15, 2016·0 cites·12 claims
- 1545US9147757B2Power semiconductor device and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 29, 2015·0 cites·6 claims
- 1644US9466589B2Power module package including heat spreader and inductance coilSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 11, 2016·0 cites·17 claims
- 1744US9356116B2Power semiconductor device and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 31, 2016·0 cites·16 claims
- 1844US9281389B2Semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 8, 2016·0 cites·19 claims
- 1943US9318589B2Insulated gate bipolar transistorSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 19, 2016·0 cites·9 claims
- 2043US9153678B2Power semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·0 cites·10 claims
- 2143US9100018B2Gate driver circuit for inductive load, inverter module, and inverter apparatus having the sameLEE JUN HO·Filed 2012·Granted Aug 4, 2015·0 cites·25 claims
- 2243US2015144989A1Power semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2342US2015187921A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2442US2015144993A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2541US2015187877A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2641US2013270689A1Semiconductor package, semiconductor module, and mounting structure thereofKIM KWANG SOO·Filed 2012·Application pending·0 cites
- 2741US2015076652A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2841US2015171198A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2940US9184247B2Power semiconductor device capable of maintaining a withstand voltageSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 10, 2015·0 cites·9 claims
- 3040US2015187869A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3140US2015144990A1Power semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3240US2015060999A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3340US2014159104A1Semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3439US2014117405A1Semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3539US2015187678A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3639US2019333837A1Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 3739US2014159105A1Power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3839US2014117374A1Semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →