Inventor · disambiguated record
Ken Varley
Also filed as: VARLEY KEN
1 granted patent·1 pending application·13 citations·filing 2000–2003
37Inventor score
Technology areasY10T
Files withVIASYSTEMS GROUP INC1
Top patents by PatentIndex Score
2 records- 0161US6651324B1Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layerVIASYSTEMS GROUP INC·Filed 2000·Granted Nov 25, 2003·13 cites·48 claims
- 0227US2004168314A1Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layerFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →