Inventor · disambiguated record
Ken Jian Ming Wang
Also filed as: WANG KEN · WANG KEN J M · WANG KEN JIAN MING
28 granted patents·12 pending applications·301 citations·filing 1998–2025
96Inventor score
Top patents by PatentIndex Score
40 records- 0196US7872335B2Lead frame-BGA package with enhanced thermal performance and I/O countsBROADCOM CORP·Filed 2007·Granted Jan 18, 2011·53 cites·22 claims
- 0293US9564569B1Hermetic solution for thermal and optical sensor-in-packageMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Feb 7, 2017·24 cites·20 claims
- 0391US9136258B1Stacked LED for optical sensor devicesMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Sep 15, 2015·19 cites·17 claims
- 0491US7618849B2Integrated circuit package with etched leadframe for package-on-package interconnectsBROADCOM CORP·Filed 2007·Granted Nov 17, 2009·20 cites·10 claims
- 0587US8269323B2Integrated circuit package with etched leadframe for package-on-package interconnectsKHAN REZAUR RAHMAN·Filed 2009·Granted Sep 18, 2012·13 cites·20 claims
- 0687US7538438B2Substrate warpage control and continuous electrical enhancementSANDISK CORP·Filed 2005·Granted May 26, 2009·15 cites·36 claims
- 0785US7746661B2Printed circuit board with coextensive electrical connectors and contact pad areasSANDISK CORP·Filed 2006·Granted Jun 29, 2010·8 cites·18 claims
- 0885US7355283B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK CORP·Filed 2005·Granted Apr 8, 2008·10 cites·12 claims
- 0979US8878368B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK TECHNOLOGIES INC·Filed 2013·Granted Nov 4, 2014·3 cites·16 claims
- 1076US5960968ATable with adjustable shelvesALLTREND CO LTD·Filed 1998·Granted Oct 5, 1999·51 cites·1 claims
- 1174US9230919B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jan 5, 2016·2 cites·22 claims
- 1272US8487441B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingCHIU CHIN-TIEN·Filed 2007·Granted Jul 16, 2013·4 cites·11 claims
- 1372US7806731B2Rounded contact fingers on substrate/PCB for crack preventionSANDISK CORP·Filed 2005·Granted Oct 5, 2010·5 cites·38 claims
- 1470US6065407ALocking sleeve assembly for a display shelfALLTREND CO LTD·Filed 1998·Granted May 23, 2000·44 cites·2 claims
- 1569US9355968B2Silicon shield for package stress sensitive devicesMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted May 31, 2016·3 cites·17 claims
- 1669US8129272B2Hidden plating tracesTAKIAR HEM·Filed 2009·Granted Mar 6, 2012·3 cites·16 claims
- 1768US7967184B2Padless substrate for surface mounted componentsSANDISK CORP·Filed 2005·Granted Jun 28, 2011·4 cites·6 claims
- 1865US2025383513A1Methods for Optical Fiber Attachment to Photonic Integrated ChipAYAR LABS INC·Filed 2025·Application pending·0 cites
- 1963US6412954B1Dust-proof device for solid integration rod in projecting apparatusCORETRONIC CORP·Filed 2000·Granted Jul 2, 2002·9 cites·4 claims
- 2061US6394611B1Solid rod dust-proof structure for projecting apparatusesCORETRONIC CORP·Filed 2000·Granted May 28, 2002·8 cites·5 claims
- 2160US7592699B2Hidden plating tracesSANDISK CORP·Filed 2005·Granted Sep 22, 2009·1 cites·18 claims
- 2258US8193613B2Semiconductor die having increased usable areaWANG KEN JIAN MING·Filed 2007·Granted Jun 5, 2012·2 cites·19 claims
- 2357US9006912B2Printed circuit board with coextensive electrical connectors and contact pad areasLIAO CHIH-CHIN·Filed 2012·Granted Apr 14, 2015·0 cites·14 claims
- 2456US10051733B2Printed circuit board with coextensive electrical connectors and contact pad areasSANDISK TECHNOLOGIES INC·Filed 2015·Granted Aug 14, 2018·0 cites·18 claims
- 2553US8217522B2Printed circuit board with coextensive electrical connectors and contact pad areasLIAO CHIH-CHIN·Filed 2010·Granted Jul 10, 2012·0 cites·13 claims
- 2652US9209159B2Hidden plating tracesTAKIAR HEM·Filed 2012·Granted Dec 8, 2015·0 cites·17 claims
- 2749US2007218588A1Integrated circuit package having stacked integrated circuits and method thereforSANDISK CORP·Filed 2007·Application pending·0 cites
- 2845US2015380627A1Lid assembly for thermopile temperature sensing device in thermal gradient environmentQUALCOMM TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 2945US2009194872A1Depopulating integrated circuit package ball locations to enable improved edge clearance in shipping trayBROADCOM CORP·Filed 2008·Application pending·0 cites
- 3045US2009108473A1Die-attach material overflow control for die protection in integrated circuit packagesBROADCOM CORP·Filed 2007·Application pending·0 cites
- 3142US8461675B2Substrate panel with plating bar structured to allow minimum kerf widthTAKIAR HEM·Filed 2005·Granted Jun 11, 2013·0 cites·18 claims
- 3241US8269321B2Low cost lead frame package and method for forming sameWANG KEN JIAN MING·Filed 2007·Granted Sep 18, 2012·0 cites·19 claims
- 3340US2008220206A1Semiconductor die for increasing yield and usable wafer areaWANG KEN JIAN MING·Filed 2007·Application pending·0 cites
- 3440US2007004094A1Method of reducing warpage in an over-molded IC packageTAKIAR HEM·Filed 2005·Application pending·0 cites
- 3540US2007001285A1Apparatus having reduced warpage in an over-molded IC packageTAKIAR HEM·Filed 2005·Application pending·0 cites
- 3640US2007163109A1Strip for integrated circuit packages having a maximized usable areaTAKIAR HEM·Filed 2005·Application pending·0 cites
- 3739US10605823B2Multiple MEMS device and methodsMCUBE INC·Filed 2017·Granted Mar 31, 2020·0 cites·21 claims
- 3839US2018318782A1Hydrogen Generator SystemINTELLIGENT ENERGY LTD·Filed 2016·Application pending·0 cites
- 3939US2012187545A1Direct through via wafer level fanout packageKHAN REZAUR RAHMAN·Filed 2011·Application pending·0 cites
- 4038US2002154016A1Computer system and method for preventing CPU burn-outFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →