Inventor · disambiguated record
Ke-Gang Wen
Also filed as: WEN KE · WEN KE-GANG
3 granted patents·28 pending applications·13 citations·filing 2012–2025
61Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23NVIDIA CORP3CHANG MING1EXCALIBUR IP LLC1ODL INCORPORATED1
Top patents by PatentIndex Score
31 records- 0180US9401774B1Limited wavelength all-to-all wavelength routing network configurationTHE US DIRECTOR NAT SECURITY AGENCY·Filed 2014·Granted Jul 26, 2016·10 cites·12 claims
- 0278US2025357429A1Interconnect Structure for Front-to-Front Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US2025364375A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US2025349676A1Semiconductor structure with backside through substrate thermal conductive viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0576US2025349675A1Semiconductor devices with backside interconnect structure and through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US2025357274A1Through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US2025336894A1Packages with dtcs on other device dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0875US2025349774A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US2025336751A1Heat dissipating structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1074US9805097B2Method and system for providing a search resultEXCALIBUR IP LLC·Filed 2014·Granted Oct 31, 2017·3 cites·20 claims
- 1173US2025323183A1Semiconductor device with seal ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1270US2025046756A1Interconnect Structure for Front-to-Front Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1370US2025046678A1Semiconductor structure with backside through substrate thermal conductive viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1470US2025210462A1Through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1570US2025087639A1Packages with dtcs on other device dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1669US2025038074A1Semiconductor devices with backside interconnect structure and through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1769US2025336770A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1869US2025046667A1Heat Dissipating Structure and Methods of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1968US2025070064A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2068US2025070052A1Semiconductor device with seal ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2165US2022334890A1Application programming interface to indicate increased resource usageNVIDIA CORP·Filed 2022·Application pending·0 cites
- 2265US2022334900A1Application programming interface to indicate increased resource usageNVIDIA CORP·Filed 2022·Application pending·0 cites
- 2365US2022334899A1Application programming interface to monitor resource usageNVIDIA CORP·Filed 2022·Application pending·0 cites
- 2458US2025336720A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2557US2025167077A1Semiconductor structures with through viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2654US2024266334A1Thermal Dissipation Structures and Methods for Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2754US2024120257A1Layer-By-Layer Formation Of Through-Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2854US2024145435A1Semiconductor device including multi-dimension through silicon via structures for backside alignment and thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2950US2017371880A1Method and system for providing a search resultCHANG MING·Filed 2017·Application pending·0 cites
- 3031US2013258841A1Method for Protecting Data Transmission in MPLS Networks Due to FailuresPARSONS KIERAN·Filed 2012·Application pending·0 cites
- 3130US10641036B2Panel unit with multiple integrated and commonly adjustable blind assembliesODL INCORPORATED·Filed 2016·Granted May 5, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →