Inventor · disambiguated record
Kendall S. Wills
Also filed as: WILLS KENDALL S · WILLS KENDALL SCOTT
24 granted patents·3 pending applications·626 citations·filing 1976–2008
96Inventor score
Top patents by PatentIndex Score
27 records- 0192US5543365AWafer scribe technique using laser by forming polysiliconTEXAS INSTRUMENTS INC·Filed 1994·Granted Aug 6, 1996·197 cites·12 claims
- 0289US4751197AMake-link programming of semiconductor devices using laser enhanced thermal breakdown of insulatorTEXAS INSTRUMENTS INC·Filed 1986·Granted Jun 14, 1988·85 cites·3 claims
- 0389US4135077ALaser bread browning apparatusWILLS KENDALL S·Filed 1976·Granted Jan 16, 1979·50 cites·2 claims
- 0488US4720908AProcess for making contacts and interconnects for holes having vertical sidewallsTEXAS INSTRUMENTS INC·Filed 1984·Granted Jan 26, 1988·64 cites·5 claims
- 0582US7474112B2Method and apparatus for non-invasively testing integrated circuitsTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 6, 2009·9 cites·5 claims
- 0675US7057409B2Method and apparatus for non-invasively testing integrated circuitsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 6, 2006·15 cites·12 claims
- 0775US6521479B1Repackaging semiconductor IC devices for failure analysisTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 18, 2003·29 cites·37 claims
- 0874US5119451AOptical waveguides as interconnects from integrated circuit to integrated circuit and packaging method using sameTEXAS INSTRUMENTS INC·Filed 1990·Granted Jun 2, 1992·32 cites·23 claims
- 0970US4912066AMake-link programming of semiconductor devices using laser-enhanced thermal breakdown of insulatorTEXAS INSTRUMENTS INC·Filed 1988·Granted Mar 27, 1990·36 cites·1 claims
- 1065US5847467ADevice packaging using heat spreaders and assisted deposition of wire bondsTEXAS INSTRUMENTS INC·Filed 1993·Granted Dec 8, 1998·34 cites·6 claims
- 1148US5149675ARing crystallization of wafers to prevent thermal shockTEXAS INSTRUMENTS INC·Filed 1990·Granted Sep 22, 1992·7 cites·6 claims
- 1247US2010127344A1Contact over isolatorTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1346US7130749B2Wavelet analysis of signals to determine characteristics of anomalies in a wireTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 31, 2006·1 cites·15 claims
- 1446US5605863ADevice packaging using heat spreaders and assisted deposition of wire bondsTEXAS INSTRUMENTS INC·Filed 1995·Granted Feb 25, 1997·13 cites·20 claims
- 1546US4623403AIndexing of laser beam for programming VLSI devicesTEXAS INSTRUMENTS INC·Filed 1984·Granted Nov 18, 1986·11 cites·7 claims
- 1645US7872486B2Wing-shaped support members for enhancing semiconductor probes and methods to form the sameTEXAS INSTRUMENTS INC·Filed 2008·Granted Jan 18, 2011·0 cites·26 claims
- 1745US5406116ADopant implant for conductive charge leakage layer for use with voltage contrastTEXAS INSTRUMENTS INC·Filed 1993·Granted Apr 11, 1995·15 cites·19 claims
- 1843US5317186ARing crystallization of wafers to prevent thermal shockTEXAS INSTRUMENTS INC·Filed 1992·Granted May 31, 1994·5 cites·18 claims
- 1943US5008729ALaser programming of semiconductor devices using diode make-link structureTEXAS INSTRUMENTS INC·Filed 1989·Granted Apr 16, 1991·9 cites·18 claims
- 2038US2005127484A1Die extender for protecting an integrated circuit die on a flip chip packageTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 2137US2010127723A1Probe pointTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 2236US5451550AMethod of laser CVD seal a die edgeTEXAS INSTRUMENTS INC·Filed 1991·Granted Sep 19, 1995·6 cites·19 claims
- 2335US5006916AVertical-walled contacts for VLSI semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1987·Granted Apr 9, 1991·6 cites·5 claims
- 2433US6281563B1Laser programming of CMOS semiconductor devices using make-link structureTEXAS INSTRUMENTS INC·Filed 1997·Granted Aug 28, 2001·2 cites·8 claims
- 2529US6355973B1Integrated circuit having a sealed edgeTEXAS INSTRUMENTS INC·Filed 1995·Granted Mar 12, 2002·0 cites·14 claims
- 2629US5960263ALaser programming of CMOS semiconductor devices using make-link structureTEXAS INSTRUMENTS INC·Filed 1993·Granted Sep 28, 1999·0 cites·10 claims
- 2728US7313490B2Wavelet analysis of one or more time domain reflectometry (TDR) signals to determine one or more characteristics of one or more anomalies in a wireTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 25, 2007·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →