Inventor · disambiguated record
Kenneth Wong
Also filed as: WONG KENNETH · WONG KENNETH N
11 granted patents·5 pending applications·96 citations·filing 1997–2018
88Inventor score
Top patents by PatentIndex Score
16 records- 0191US7655613B2Solubilizing systems for flavors and fragrancesFIRMENICH & CIE·Filed 2007·Granted Feb 2, 2010·13 cites·19 claims
- 0290US6379394B1Soil-repellent agent and process for the treatment of articles based on woven cottonRHODIA CHIMIE SA·Filed 2000·Granted Apr 30, 2002·52 cites·20 claims
- 0387US7846889B2Solubilizing systems for flavors and fragrancesFIRMENICH & CIE·Filed 2009·Granted Dec 7, 2010·8 cites·19 claims
- 0480US8822404B2Perfuming compositions and uses thereofWONG KENNETH·Filed 2011·Granted Sep 2, 2014·4 cites·20 claims
- 0578US9296978B2Perfuming compositions and uses thereofWONG KENNETH·Filed 2012·Granted Mar 29, 2016·3 cites·16 claims
- 0674US6554869B2Polymers for laundry applicationsUNILEVER HOME & PERSONAL CARE·Filed 2001·Granted Apr 29, 2003·15 cites·16 claims
- 0770US10383351B2Granules comprising an active substanceFIRMENICH & CIE·Filed 2018·Granted Aug 20, 2019·0 cites·16 claims
- 0869US9974323B2Process for preparing granules comprising an active substanceFIRMENICH & CIE·Filed 2012·Granted May 22, 2018·0 cites·14 claims
- 0951US7479687B2Deep via seed repair using electroless plating chemistryINTEL CORP·Filed 2005·Granted Jan 20, 2009·0 cites·7 claims
- 1050US2007099007A1Use of hydrophilic (co) polymers in crosslinkable aqueous silicone emulsionsBENAYOUN JEAN-PAUL·Filed 2006·Application pending·0 cites
- 1146US9428712B2Perfuming compositions and uses thereofFIRMENICH & CIE·Filed 2012·Granted Aug 30, 2016·0 cites·17 claims
- 1245US2005089697A1Use of hydrophilic (co) polymers in crosslinkable aqueous silicone emulsionsFiled 2004·Application pending·0 cites
- 1343US2003143408A1Use of hydrophilic (co) polymers in crosslinkable aqueous silicone emulsionsFiled 2001·Application pending·0 cites
- 1442US2006084589A1Solubilizing systems for flavors and fragrancesVLAD FLORIN J·Filed 2005·Application pending·0 cites
- 1541US2005067295A1Deep via seed repair using electroless plating chemistryFiled 2003·Application pending·0 cites
- 1626US6291420B1System containing a non-ionic surfactant and an alkali metal silicateRHODIA CHIMIE SA·Filed 1997·Granted Sep 18, 2001·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →