Inventor · disambiguated record
Keng-Chung Wu
Also filed as: WU KENG-CHUNG
4 granted patents·2 pending applications·6 citations·filing 2008–2013
63Inventor score
Top patents by PatentIndex Score
6 records- 0166US8431835B2Packaging device for an electronic element and method for making the sameCHIANG WEN-CHUNG·Filed 2010·Granted Apr 30, 2013·4 cites·15 claims
- 0259US8549739B2Method of making circuit board moduleCHIANG WEN-CHUNG·Filed 2010·Granted Oct 8, 2013·2 cites·6 claims
- 0345US8898892B2Method of making circuit board moduleTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2013·Granted Dec 2, 2014·0 cites·5 claims
- 0443US2009152237A1Ceramic-Copper Foil Bonding MethodHIGH CONDUCTION SCIENT CO LTD·Filed 2008·Application pending·0 cites
- 0540US8461614B2Packaging substrate device, method for making the packaging substrate device, and packaged light emitting deviceCHIANG WEN-CHUNG·Filed 2010·Granted Jun 11, 2013·0 cites·11 claims
- 0634US2010236819A1Printed circuit board and method for making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →