Inventor · disambiguated record
Kensuke Yoshihara
Also filed as: YOSHIHARA KENSUKE
1 granted patent·9 pending applications·2 citations·filing 2010–2023
19Inventor score
Top patents by PatentIndex Score
10 records- 0166US2018009979A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0261US2014283972A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0356US9349931B2Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED deviceNISHIYAMA TOMOO·Filed 2012·Granted May 24, 2016·2 cites·24 claims
- 0454US2025142731A1Wiring substrate production method, wiring substrate, reticle, and exposure pattern-rendering data structureRESONAC CORP·Filed 2023·Application pending·0 cites
- 0553US2025278024A1Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0648US2012251830A1Resin composition, resin sheet, and cured resin material and method for producing the sameNISHIYAMA TOMOO·Filed 2010·Application pending·0 cites
- 0747US2025191978A1Pattern inspection method, method for manufacturing resist pattern, target substrate selection method, and method for manufacturing target substrateRESONAC CORP·Filed 2023·Application pending·0 cites
- 0842US2025344324A1Pattern formation method and pattern formation structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 0931US2012244351A1Multilayer resin sheet and method for producing the same, method for producing cured multilayer resin sheet, and highly thermally conductive resin sheet laminate and method for producing the sameKATAGI HIDEYUKI·Filed 2010·Application pending·0 cites
- 1029US2013189514A1Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor deviceNISHIYAMA TOMOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →