Inventor · disambiguated record
Keisuke Yoshikawa
Also filed as: YOSHIKAWA KEISUKE
11 granted patents·7 pending applications·142 citations·filing 2001–2025
89Inventor score
Files withNITTO DENKO CORP4DAINIPPON PRINTING CO LTD3MITSUBISHI HEAVY IND LTD3PRIME PLANET ENERGY & SOLUTIONS INC2IKENAGA CHIKAO1
Top patents by PatentIndex Score
18 records- 0191US7262514B2Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Aug 28, 2007·25 cites·8 claims
- 0291US6756793B2Capacitance type moisture sensor and method of producing the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2001·Granted Jun 29, 2004·58 cites·24 claims
- 0384US7365441B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 29, 2008·15 cites·3 claims
- 0476US7064011B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodNITTO DENKO CORP·Filed 2004·Granted Jun 20, 2006·21 cites·9 claims
- 0573US2024290939A1Method of manufacturing batteryPRIME PLANET ENERGY & SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0670US8340787B2Monitoring and control deviceYOSHIKAWA KEISUKE·Filed 2010·Granted Dec 25, 2012·6 cites·26 claims
- 0769US8560090B2Monitor and control apparatusSASAKI TOMOAKI·Filed 2010·Granted Oct 15, 2013·3 cites·3 claims
- 0865US8018044B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted Sep 13, 2011·3 cites·6 claims
- 0963US7132755B2Adhesive film for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Nov 7, 2006·11 cites·9 claims
- 1063US2025288964A1Electricity storage device electrode slurry manufacturing apparatus and method of manufacturing electricity storage device electrode slurryPRIME PLANET ENERGY & SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1144US8525351B2Semiconductor device, substrate for producing semiconductor device and method of producing themIKENAGA CHIKAO·Filed 2011·Granted Sep 3, 2013·0 cites·6 claims
- 1239US7943427B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted May 17, 2011·0 cites·3 claims
- 1337US7268191B2Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained therebyNITTO DENKO CORP·Filed 2004·Granted Sep 11, 2007·0 cites·2 claims
- 1437US2013194734A1Receptacle and plugPANASONIC CORP·Filed 2013·Application pending·0 cites
- 1536US2015266151A1Tool changing method for machine toolMITSUBISHI HEAVY IND LTD·Filed 2015·Application pending·0 cites
- 1636US2015266149A1Machine toolMITSUBISHI HEAVY IND LTD·Filed 2015·Application pending·0 cites
- 1733US2012229131A1Magnetic field sensor, as well as magnetic field measurement method, power measurement device, and power measurement method using the sameTAKENAGA HIDEKI·Filed 2010·Application pending·0 cites
- 1829US2015266150A1Tool changing method for machine toolMITSUBISHI HEAVY IND LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →