Inventor · disambiguated record
Ke-Jing Yu
Also filed as: YU KE · YU KE-JING
13 granted patents·9 pending applications·21 citations·filing 2004–2025
87Inventor score
Top patents by PatentIndex Score
22 records- 0193US10825721B2Insulating cap on contact structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 3, 2020·9 cites·20 claims
- 0290US12040225B2Insulating cap on contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·1 cites·20 claims
- 0381US11018057B2Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 25, 2021·1 cites·20 claims
- 0481US2024339356A1Insulating cap on contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0578US2025338522A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US11139203B2Using mask layers to facilitate the formation of self-aligned contacts and viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·2 cites·20 claims
- 0772US11837663B2Via structure with low resistivity and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 0871US11393717B2Insulating cap on contact structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·0 cites·20 claims
- 0971US10658237B2Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·1 cites·20 claims
- 1071US2025089275A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1169US11081585B2Via structure with low resistivity and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·20 claims
- 1264US2025385174A1Capacitors in interconnect structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1362US11355603B2Methods and structures of novel contact featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 1459US7506115B2Incremental provisioning of softwareINTEL CORP·Filed 2004·Granted Mar 17, 2009·7 cites·29 claims
- 1559US2025210508A1Interconnect structure with capacitor and methods for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1658US10693004B2Via structure with low resistivity and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1757US2025126819A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1856US10522633B2Methods and structures of novel contact featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 1955US2025228027A1Semiconductor structure including image sensor and mram deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2054US2025022870A1Small dummy poly pattern insertion in small border regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2153US9728505B2Methods and structrues of novel contact featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·0 cites·20 claims
- 2241US2006047927A1Incremental provisioning of softwareXING BIN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →