Inventor · disambiguated record
Kewei Zuo
Also filed as: ZUO KEWEI
20 granted patents·5 pending applications·102 citations·filing 2007–2024
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14TAIWAN SEMICONDUCTOR MFG3KO FRANCIS2WANG CHIEN RHONE2LIN CHUN-HSIEN1
Top patents by PatentIndex Score
25 records- 0195US7974728B2System for extraction of key process parameters from fault detection classification to enable wafer predictionTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 5, 2011·51 cites·14 claims
- 0290US11626304B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0387US10964566B2Machine learning on overlay virtual metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·4 cites·20 claims
- 0482US8682466B2Automatic virtual metrology for semiconductor wafer result predictionKO FRANCIS·Filed 2008·Granted Mar 25, 2014·13 cites·17 claims
- 0579US8433434B2Near non-adaptive virtual metrology and chamber controlWANG AMY·Filed 2010·Granted Apr 30, 2013·6 cites·20 claims
- 0678US9010617B2Solder joint reflow process for reducing packaging failure rateYU CHEN-HUA·Filed 2011·Granted Apr 21, 2015·5 cites·9 claims
- 0778US8945983B2System and method to improve package and 3DIC yield in underfill processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·6 cites·20 claims
- 0877US12237188B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0977US7972969B2Method and apparatus for thinning a substrateTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 5, 2011·5 cites·13 claims
- 1076US2025123572A1Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1172US9508653B2Die-tracing in integrated circuit manufacturing and packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·3 cites·20 claims
- 1265US12197138B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 1365US9390491B2System and method for automatic quality control for assembly line processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 12, 2016·2 cites·18 claims
- 1465US9037279B2Clustering for prediction models in process control and for optimal dispatchingKO FRANCIS·Filed 2010·Granted May 19, 2015·1 cites·20 claims
- 1559US9177843B2Preventing contamination in integrated circuit manufacturing linesSUNG CHIEN-MING·Filed 2007·Granted Nov 3, 2015·2 cites·20 claims
- 1659US8905124B2Temperature controlled loadlock chamberLIN CHUN-HSIEN·Filed 2007·Granted Dec 9, 2014·1 cites·15 claims
- 1757US9390060B2Packaging methods, material dispensing methods and apparatuses, and automated measurement systemsWANG CHIEN RHONE·Filed 2012·Granted Jul 12, 2016·1 cites·14 claims
- 1857US2025087592A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1955US9588505B2Near non-adaptive virtual metrology and chamber controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 7, 2017·0 cites·20 claims
- 2055US2025372552A1Bonded structure with half-oval bonding pad pair design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2155US2024387447A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2254US10054938B2Clustering for prediction models in process control and for optimal dispatchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 21, 2018·0 cites·20 claims
- 2352US9698030B2Temperature controlled loadlock chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 4, 2017·0 cites·20 claims
- 2446US2015051860A1Automatic optical appearance inspection by line scan apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Application pending·0 cites
- 2539US9153506B2System and method for through silicon via yieldWANG CHIEN RHONE·Filed 2012·Granted Oct 6, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →