Inventor · disambiguated record
Khang Choong Yong
Also filed as: YONG KHANG CHOONG
55 granted patents·7 pending applications·57 citations·filing 2014–2025
97Inventor score
Top patents by PatentIndex Score
62 records- 0190US10085342B2Microelectronic device having an air core inductorINTEL CORP·Filed 2016·Granted Sep 25, 2018·6 cites·23 claims
- 0289US10386941B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2015·Granted Aug 20, 2019·5 cites·17 claims
- 0388US9836095B1Microelectronic device package electromagnetic shieldINTEL CORP·Filed 2016·Granted Dec 5, 2017·6 cites·22 claims
- 0487US10996773B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2019·Granted May 4, 2021·3 cites·24 claims
- 0586US10796999B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2019·Granted Oct 6, 2020·4 cites·18 claims
- 0682US10516366B2Crystal oscillator interconnect architecture with noise immunityINTEL CORP·Filed 2018·Granted Dec 24, 2019·3 cites·21 claims
- 0781US10388636B2Integrating system in package (SIP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2015·Granted Aug 20, 2019·3 cites·25 claims
- 0881US10356902B2Board to board interconnectINTEL CORP·Filed 2015·Granted Jul 16, 2019·3 cites·10 claims
- 0977US10158339B2Capacitive compensation structures using partially meshed ground planesINTEL CORP·Filed 2015·Granted Dec 18, 2018·2 cites·11 claims
- 1076US11277903B2Pattern-edged metal-plane resonance-suppressionINTEL CORP·Filed 2019·Granted Mar 15, 2022·1 cites·7 claims
- 1175US10079158B2Vertical trench routing in a substrateINTEL CORP·Filed 2014·Granted Sep 18, 2018·3 cites·17 claims
- 1274US10701796B2Electromagnetic interference (EMI) shieldINTEL CORP·Filed 2018·Granted Jun 30, 2020·2 cites·19 claims
- 1373US10171033B2Crystal oscillator interconnect architecture with noise immunityINTEL CORP·Filed 2017·Granted Jan 1, 2019·2 cites·24 claims
- 1473US10153253B2Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatusINTEL CORP·Filed 2016·Granted Dec 11, 2018·2 cites·19 claims
- 1572US11729900B2Pattern-edged metal-plane resonance-suppressionINTEL CORP·Filed 2022·Granted Aug 15, 2023·0 cites·13 claims
- 1672US11422642B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2021·Granted Aug 23, 2022·0 cites·42 claims
- 1772US10772206B2Board to board interconnectINTEL CORP·Filed 2019·Granted Sep 8, 2020·1 cites·4 claims
- 1872US2025337200A1Advanced grounding connector for enhanced signal integrityMOLEX LLC·Filed 2025·Application pending·0 cites
- 1971US11658127B2RFI free picture frame metal stiffenerINTEL CORP·Filed 2019·Granted May 23, 2023·1 cites·28 claims
- 2071US11614811B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2021·Granted Mar 28, 2023·0 cites·19 claims
- 2170US11061492B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2020·Granted Jul 13, 2021·0 cites·22 claims
- 2269US12002793B2Integrating system in package (SiP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·8 claims
- 2369US11552403B2Slot antenna on a printed circuit board (PCB)INTEL CORP·Filed 2021·Granted Jan 10, 2023·0 cites·16 claims
- 2469US10643983B2Extended stiffener for platform miniaturizationINTEL CORP·Filed 2018·Granted May 5, 2020·1 cites·9 claims
- 2569US10108227B2Techniques for providing an interface component for a wearable deviceINTEL CORP·Filed 2015·Granted Oct 23, 2018·1 cites·23 claims
- 2667US11304299B2Board to board interconnectINTEL CORP·Filed 2020·Granted Apr 12, 2022·0 cites·24 claims
- 2767US10083922B2Inductor interconnectINTEL CORP·Filed 2016·Granted Sep 25, 2018·1 cites·22 claims
- 2866US12506307B2High-speed, hermaphroditic connector and connector assembliesMOLEX LLC·Filed 2021·Granted Dec 23, 2025·0 cites·23 claims
- 2966US11393760B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 3066US11290059B2Crystal oscillator interconnect architecture with noise immunityINTEL CORP·Filed 2019·Granted Mar 29, 2022·0 cites·17 claims
- 3164US9606949B1Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enablingINTEL CORP·Filed 2015·Granted Mar 28, 2017·1 cites·18 claims
- 3264US9455752B2Apparatus and method for adaptive common mode noise decomposition and tuningINTEL CORP·Filed 2014·Granted Sep 27, 2016·1 cites·20 claims
- 3360US11114421B2Integrating system in package (SiP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·17 claims
- 3455US10716209B2Fiber weave-sandwiched differential pair routing techniqueINTEL CORP·Filed 2019·Granted Jul 14, 2020·0 cites·20 claims
- 3554US9489333B2Adaptive termination scheme for low power high speed busINTEL CORP·Filed 2014·Granted Nov 8, 2016·0 cites·19 claims
- 3654US2025392069A1Dual conductor cable adapterMOLEX LLC·Filed 2023·Application pending·0 cites
- 3753US11211714B2Slot antenna on a printed circuit board (PCB)INTEL CORP·Filed 2017·Granted Dec 28, 2021·0 cites·4 claims
- 3853US11177226B2Flexible shield for semiconductor devicesINTEL CORP·Filed 2019·Granted Nov 16, 2021·0 cites·15 claims
- 3953US10484231B2Routing-over-void-T-line-compensationINTEL CORP·Filed 2018·Granted Nov 19, 2019·0 cites·20 claims
- 4053US10396834B2Apparatus and method for adaptive common mode noise decomposition and tuningINTEL CORP·Filed 2016·Granted Aug 27, 2019·0 cites·18 claims
- 4152US11652057B2Disaggregated die interconnection with on-silicon cavity bridgeINTEL CORP·Filed 2019·Granted May 16, 2023·0 cites·25 claims
- 4252US10652999B2Mutual inductance suppressor for crosstalk immunity enhancementINTEL CORP·Filed 2016·Granted May 12, 2020·0 cites·25 claims
- 4351US10256519B2Stranded transmission line and uses thereofINTEL CORP·Filed 2016·Granted Apr 9, 2019·0 cites·20 claims
- 4449US10973116B23D high-inductive ground plane for crosstalk reductionINTEL CORP·Filed 2017·Granted Apr 6, 2021·0 cites·14 claims
- 4549US9552995B2Electrical interconnect for an electronic packageINTEL CORP·Filed 2014·Granted Jan 24, 2017·0 cites·24 claims
- 4648US11955436B2Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmissionINTEL CORP·Filed 2019·Granted Apr 9, 2024·0 cites·17 claims
- 4748US11798894B2Devices and methods for signal integrity protection techniqueINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·8 claims
- 4846USD788626SSmartwatchINTEL CORP·Filed 2014·Granted Jun 6, 2017·5 cites·1 claims
- 4945US11153968B2Device, system and method to promote the integrity of signal communicationsINTEL CORP·Filed 2017·Granted Oct 19, 2021·0 cites·25 claims
- 5045US10734333B2Semiconductor package having inductive lateral interconnectsINTEL CORP·Filed 2016·Granted Aug 4, 2020·0 cites·20 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →