Inventor · disambiguated record
Ki-Soon Bae
Also filed as: BAE KI-SOON
9 granted patents·1 pending application·104 citations·filing 1999–2021
88Inventor score
Top patents by PatentIndex Score
10 records- 0192US7533913B2Front structure for car bodyHYUNDAI MOTOR CO LTD·Filed 2006·Granted May 19, 2009·36 cites·6 claims
- 0283USD996325SVehicle fenderHYUNDAI MOTOR CO LTD·Filed 2021·Granted Aug 22, 2023·8 cites·1 claims
- 0381US6825091B2Semiconductor memory device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 30, 2004·29 cites·13 claims
- 0475US7956386B2Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 7, 2011·7 cites·23 claims
- 0571US8836109B2Semiconductor device and method of manufacturing a semiconductor deviceYUN KI-YOUNG·Filed 2012·Granted Sep 16, 2014·9 cites·15 claims
- 0665US6548851B2Semiconductor memory device with increased level of integrationSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 15, 2003·11 cites·14 claims
- 0762US9145172B2Vehicle body reinforcing structureHYUNDAI MOTOR CO LTD·Filed 2014·Granted Sep 29, 2015·3 cites·6 claims
- 0849US8710673B2Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Apr 29, 2014·0 cites·8 claims
- 0943US2011207271A1Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 1029US6331377B2Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 18, 2001·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →