Inventor · disambiguated record
Kishore K. Chakravorty
Also filed as: CHAKRAVORTY KISHORE · CHAKRAVORTY KISHORE K · CHAKRAVORTY KISHORE KUMAR
48 granted patents·2 pending applications·2,531 citations·filing 1989–2010
99Inventor score
Files withINTEL CORP16BOEING CO10CANDESCENT TECH CORP7INST OF MICROELECTRONICS4CANDESCENT INTELLECTUAL PROP3
Top patents by PatentIndex Score
50 records- 0198US6970362B1Electronic assemblies and systems comprising interposer with embedded capacitorsINTEL CORP·Filed 2000·Granted Nov 29, 2005·147 cites·24 claims
- 0298US6611419B1Electronic assembly comprising substrate with embedded capacitorsINTEL CORP·Filed 2000·Granted Aug 26, 2003·192 cites·37 claims
- 0398US6181569B1Low cost chip size package and method of fabricating the sameFiled 1999·Granted Jan 30, 2001·344 cites·8 claims
- 0497US7339798B2Electronic assemblies and systems comprising interposer with embedded capacitorsINTEL CORP·Filed 2005·Granted Mar 4, 2008·57 cites·10 claims
- 0597US6512861B2Packaging and assembly method for optical couplingINTEL CORP·Filed 2001·Granted Jan 28, 2003·117 cites·43 claims
- 0697US6452776B1Capacitor with defect isolation and bypassINTEL CORP·Filed 2000·Granted Sep 17, 2002·151 cites·11 claims
- 0797US6350668B1Low cost chip size package and method of fabricating the sameFiled 2000·Granted Feb 26, 2002·159 cites·7 claims
- 0896US6477034B1Interposer substrate with low inductance capacitive pathsINTEL CORP·Filed 2001·Granted Nov 5, 2002·130 cites·21 claims
- 0995US6775150B1Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufactureINTEL CORP·Filed 2000·Granted Aug 10, 2004·70 cites·33 claims
- 1095US6754407B2Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a boardINTEL CORP·Filed 2002·Granted Jun 22, 2004·104 cites·22 claims
- 1195US6532143B2Multiple tier array capacitorINTEL CORP·Filed 2000·Granted Mar 11, 2003·101 cites·14 claims
- 1293US6963483B2Self-aligned coaxial via capacitorsINTEL CORP·Filed 2003·Granted Nov 8, 2005·66 cites·36 claims
- 1393US5098860AMethod of fabricating high-density interconnect structures having tantalum/tantalum oxide layersBOEING CO·Filed 1990·Granted Mar 24, 1992·160 cites·9 claims
- 1491US6144144APatterned resistor suitable for electron-emitting deviceCANDESCENT TECH CORP·Filed 1997·Granted Nov 7, 2000·72 cites·52 claims
- 1590US7049704B2Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a boardINTEL CORP·Filed 2004·Granted May 23, 2006·49 cites·27 claims
- 1690US6565730B2Self-aligned coaxial via capacitorsINTEL CORP·Filed 1999·Granted May 20, 2003·64 cites·12 claims
- 1785US8221945B2Pellicle frame and lithographic pellicleSHIRASAKI TORU·Filed 2010·Granted Jul 17, 2012·5 cites·20 claims
- 1885US8221944B2Pellicle frame and lithographic pellicleSHIRASAKI TORU·Filed 2010·Granted Jul 17, 2012·8 cites·12 claims
- 1985US7120031B2Data processing system comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2004·Granted Oct 10, 2006·26 cites·3 claims
- 2083US7535728B2Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2006·Granted May 19, 2009·8 cites·15 claims
- 2182US5893724AMethod for forming a highly reliable and planar ball grid array packageINST OF MICROELECTRONICS·Filed 1996·Granted Apr 13, 1999·57 cites·15 claims
- 2281US4974048AIntegrated circuit having reroutable conductive pathsBOEING CO·Filed 1989·Granted Nov 27, 1990·60 cites·30 claims
- 2380US5149615AMethod for producing a planar surface on which a conductive layer can be appliedBOEING CO·Filed 1991·Granted Sep 22, 1992·65 cites·20 claims
- 2479US5892290AHighly reliable and planar ball grid array packageINST OF MICROELECTRONICS·Filed 1996·Granted Apr 6, 1999·55 cites·16 claims
- 2579US5436504AInterconnect structures having tantalum/tantalum oxide layersBOEING CO·Filed 1993·Granted Jul 25, 1995·61 cites·11 claims
- 2676US5112448ASelf-aligned process for fabrication of interconnect structures in semiconductor applicationsBOEING CO·Filed 1989·Granted May 12, 1992·43 cites·46 claims
- 2773US4988413AReducing plating anomalies in electroplated fine geometry conductive featuresBOEING CO·Filed 1989·Granted Jan 29, 1991·24 cites·28 claims
- 2871US7851109B2Low stress pellicle frames and reticle pellicle assembliesINTEL CORP·Filed 2008·Granted Dec 14, 2010·3 cites·20 claims
- 2969US6448708B1Dual-layer metal for flat panel displayCANDESCENT INTELLECTUAL PTY SERVICES·Filed 2000·Granted Sep 10, 2002·11 cites·10 claims
- 3065US7418163B2Optoelectrical packageCHAKRAVORTY KISHORE K·Filed 2002·Granted Aug 26, 2008·10 cites·18 claims
- 3164US7112285B2Conductive core substrate fabricationINTEL CORP·Filed 2002·Granted Sep 26, 2006·10 cites·11 claims
- 3260US6764366B1Electrode structure and method for forming electrode structure for a flat panel displayCANDESCENT INTELLECTUAL PROP·Filed 2001·Granted Jul 20, 2004·3 cites·38 claims
- 3358US6710525B1Electrode structure and method for forming electrode structure for a flat panel displayCANDESCENT TECH CORP·Filed 1999·Granted Mar 23, 2004·10 cites·4 claims
- 3456US6844663B1Structure and method for forming a multilayer electrode for a flat panel display deviceCANDESCENT INTELLECTUAL PROP·Filed 2000·Granted Jan 18, 2005·2 cites·13 claims
- 3553US5836520AApparatus for dispensing fluid in an array patternINST OF MICROELECTRONICS·Filed 1996·Granted Nov 17, 1998·18 cites·14 claims
- 3648US5168542ALow loss channel waveguide and method for making the sameBOEING CO·Filed 1991·Granted Dec 1, 1992·14 cites·25 claims
- 3747US8467035B2Pellicle frame and lithographic pellicleSHIRASAKI TORU·Filed 2010·Granted Jun 18, 2013·0 cites·12 claims
- 3845US6149792ARow electrode anodizationCANDESCENT TECH CORP·Filed 1997·Granted Nov 21, 2000·5 cites·7 claims
- 3945US5967577AApparatus for dispensing fluid in an array patternINST OF MICROELECTRONICS·Filed 1998·Granted Oct 19, 1999·12 cites·8 claims
- 4042US5081005AMethod for reducing chemical interaction between copper features and photosensitive dielectric compositionsBOEING CO·Filed 1989·Granted Jan 14, 1992·11 cites·7 claims
- 4140US5942841ARow electrode anodizationCANDESCENT TECH CORP·Filed 1998·Granted Aug 24, 1999·3 cites·10 claims
- 4237US6103095ANon-hazardous wet etching methodCANDESCENT TECH CORP·Filed 1998·Granted Aug 15, 2000·2 cites·12 claims
- 4336US5609797AMethod for recording refractive index patterns in polyimide filmsBOEING CO·Filed 1996·Granted Mar 11, 1997·5 cites·10 claims
- 4435US6095883ASpatially uniform deposition of polymer particles during gate electrode formationCANDLESCENT TECHNOLOGIES CORP·Filed 1997·Granted Aug 1, 2000·6 cites·21 claims
- 4535US2007231712A1Alternating phase shift maskingPANG SONG·Filed 2006·Application pending·0 cites
- 4634US6039621AGate electrode formation methodCANDESCENT TECH CORP·Filed 1997·Granted Mar 21, 2000·3 cites·33 claims
- 4733US2009098469A1Process for fabrication of alternating phase shift masksCHAKRAVORTY KISHORE K·Filed 2007·Application pending·0 cites
- 4832US6217403B1Gate electrode formation methodCANDESCENT TECH CORP·Filed 1999·Granted Apr 17, 2001·2 cites·9 claims
- 4932US5124238AFabrication of microelectronics using photosensitive polyimidesBOEING CO·Filed 1990·Granted Jun 23, 1992·6 cites·18 claims
- 5026US6433473B1Row electrode anodizationCANDESCENT INTELLECTUAL PROP·Filed 1999·Granted Aug 13, 2002·0 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →