Inventor · disambiguated record
Kimio Hagi
Also filed as: HAGI KIMIO
11 granted patents·462 citations·filing 1992–2000
93Inventor score
Top patents by PatentIndex Score
11 records- 0194US5604380ASemiconductor device having a multilayer interconnection structureMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 18, 1997·120 cites·8 claims
- 0289US5341026ASemiconductor device having a titanium and a titanium compound multilayer interconnection structureMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 23, 1994·110 cites·9 claims
- 0380US5565378AProcess of passivating a semiconductor device bonding pad by immersion in O2 or O3 solutionMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 15, 1996·66 cites·20 claims
- 0479US6778377B2Electrostatic chucking system, and apparatus and method of manufacturing a semiconductor device using the electrostatic chucking systemRENESAS TECH CORP·Filed 2000·Granted Aug 17, 2004·23 cites·5 claims
- 0567US5480836AMethod of forming an interconnection structureMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jan 2, 1996·34 cites·4 claims
- 0660US5728630AMethod of making a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 17, 1998·23 cites·9 claims
- 0758US5306947ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 26, 1994·32 cites·7 claims
- 0852US5889330ASemiconductor device whose flattening resin film component has a controlled carbon atom contentMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 30, 1999·18 cites·1 claims
- 0947US6414395B1Semiconductor device capable of preventing disconnection in a through holeMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 2, 2002·19 cites·5 claims
- 1045US5859478ASemiconductor device including a main alignment mark having peripheral minute alignment marksMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 12, 1999·12 cites·8 claims
- 1134US6304001B1Semiconductor device with alignment mark and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 16, 2001·5 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →