Inventor · disambiguated record
Kiyoshi Hatanaka
Also filed as: HATANAKA KIYOSHI
16 granted patents·5 pending applications·67 citations·filing 2001–2015
90Inventor score
Top patents by PatentIndex Score
21 records- 0181US8841226B2Dielectric ceramic compositionTDK CORP·Filed 2012·Granted Sep 23, 2014·4 cites·4 claims
- 0281US7204667B2High strength bolted structure and method of securing nut and torque-shear type high strength bolt and joining method using sameNIPPON STEEL BOLTEN CO LTD·Filed 2001·Granted Apr 17, 2007·35 cites·10 claims
- 0376US7243424B2Production method for a multilayer ceramic substrateTDK CORP·Filed 2005·Granted Jul 17, 2007·6 cites·9 claims
- 0474US7403085B2RF moduleTDK CORP·Filed 2004·Granted Jul 22, 2008·10 cites·10 claims
- 0561US7662477B2Multilayer ceramics substrateTDK CORP·Filed 2007·Granted Feb 16, 2010·2 cites·3 claims
- 0661US7578058B2Production method of a multilayer ceramic substrateTDK CORP·Filed 2006·Granted Aug 25, 2009·2 cites·48 claims
- 0760US9780559B2ESD protection deviceTDK CORP·Filed 2014·Granted Oct 3, 2017·1 cites·2 claims
- 0859US8846210B2Ceramic electronic component and method of manufacturing ceramic electronic componentSAKURAI TOSHIO·Filed 2011·Granted Sep 30, 2014·1 cites·6 claims
- 0951US7155816B2Method for producing a multilayer ceramic substrateTDK CORP·Filed 2003·Granted Jan 2, 2007·5 cites·2 claims
- 1051US2007177958A1High strength bolted structure and method of securing nut and torque-shear type high strength bolt and joining method using sameNIPPON STEEL BOLTEN CO LTD·Filed 2007·Application pending·0 cites
- 1151US2007110956A1Multilayer ceramic substrate and its production methodTDK CORP·Filed 2007·Application pending·0 cites
- 1250US9601816B2Dielectric line and electronic componentTDK CORP·Filed 2014·Granted Mar 21, 2017·0 cites·9 claims
- 1350US7973615B2RF moduleTDK CORP·Filed 2010·Granted Jul 5, 2011·0 cites·8 claims
- 1450US7750760B2RF moduleTDK CORP·Filed 2008·Granted Jul 6, 2010·0 cites·12 claims
- 1550US7733663B2Multilayer ceramic substrateTDK CORP·Filed 2008·Granted Jun 8, 2010·0 cites·2 claims
- 1649US9647316B2Transmission line and electronic componentTDK CORP·Filed 2015·Granted May 9, 2017·0 cites·8 claims
- 1748US9698464B2Transmission line and electronic componentTDK CORP·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 1848US2013190163A1Dielectric ceramic and electronic component using the sameTDK CORP·Filed 2012·Application pending·0 cites
- 1947US7439829B2RF moduleTDK CORP·Filed 2004·Granted Oct 21, 2008·1 cites·7 claims
- 2040US2010244987A1Ceramic electronic componentTDK CORP·Filed 2010·Application pending·0 cites
- 2137US2006127568A1Multi-layer ceramic substrate and method for manufacture thereofTDK CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →