Inventor · disambiguated record
Kiyohiro Hine
Also filed as: HINE KIYOHIRO
16 granted patents·5 pending applications·1 citations·filing 2011–2024
84Inventor score
Top patents by PatentIndex Score
21 records- 0171US2025121461A1Bonding material and bonded structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0268US10493567B2Solder alloy and bonded structure using the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Dec 3, 2019·1 cites·3 claims
- 0366US9728784B2Carbon material for power storage device electrode, method of producing the same and power storage device using the samePANASONIC IP MAN CO LTD·Filed 2014·Granted Aug 8, 2017·0 cites·10 claims
- 0462US11318534B2Metal microparticle production method and metal microparticle production devicePANASONIC IP MAN CO LTD·Filed 2019·Granted May 3, 2022·0 cites·7 claims
- 0561US9199340B2Solder material and bonded structurePANASONIC IP MAN CO LTD·Filed 2014·Granted Dec 1, 2015·0 cites·12 claims
- 0660US2025108463A1Bonding material and bonding structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0755US10636724B2Mount structurePANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·9 claims
- 0854US9789569B2Solder material and bonded structurePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 17, 2017·0 cites·12 claims
- 0953US11515280B2Mounting structure and nanoparticle mounting materialPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·3 claims
- 1053US9981348B2Solder alloy and mounted structure using samePANASONIC IP MAN CO LTD·Filed 2016·Granted May 29, 2018·0 cites·5 claims
- 1151US11515281B2Bonded structure and bonding materialPANASONIC CORP·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 1251US11135683B2Solder alloy and junction structure using samePANASONIC IP MAN CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·8 claims
- 1351US10960496B2Solder alloy and package structure using samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 30, 2021·0 cites·5 claims
- 1449US11476399B2Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Oct 18, 2022·0 cites·8 claims
- 1544US10170442B2Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layerPANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 1, 2019·0 cites·6 claims
- 1644US9386699B2Mounted structure and manufacturing method of mounted structureHINE KIYOHIRO·Filed 2011·Granted Jul 5, 2016·0 cites·7 claims
- 1741US8552307B2Mounting structureHINE KIYOHIRO·Filed 2011·Granted Oct 8, 2013·0 cites·7 claims
- 1840US2017266767A1Flux for soldering, and soldering paste composition including samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 1938US10068869B2Mounting structure and BGA ballPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·2 claims
- 2038US2018257179A1Solder alloy and joint structurePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2137US2017282305A1Solder alloy and package structure using samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →