Inventor · disambiguated record
Kiyoshi Hyodo
Also filed as: HYODO KIYOSHI
3 granted patents·3 pending applications·12 citations·filing 2000–2010
60Inventor score
Top patents by PatentIndex Score
6 records- 0159US6917848B1Production system for printed wiring boardFUJITSU LTD·Filed 2000·Granted Jul 12, 2005·10 cites·10 claims
- 0243US6893576B1Method of manufacturing multi-layer printed wiring boardFUJITSU LTD·Filed 2000·Granted May 17, 2005·2 cites·16 claims
- 0338US2008136041A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 0434US2007221329A1Apparatus and method for distributing a liquid onto a surface of an itemTESSERA INTERCONNECT MATERIALS·Filed 2006·Application pending·0 cites
- 0533US2008169568A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 0631US8736064B2Structure and method of making interconnect element having metal traces embedded in surface of dielectricKOTAKE HIDEKI·Filed 2010·Granted May 27, 2014·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →