Inventor · disambiguated record
Kiyoshi Ishibashi
Also filed as: ISHIBASHI KIYOSHI
18 granted patents·1 pending application·211 citations·filing 1979–2010
94Inventor score
Top patents by PatentIndex Score
19 records- 0187US8690838B2Transdermal administration deviceOZAWA HIROSHI·Filed 2010·Granted Apr 8, 2014·34 cites·11 claims
- 0277US5424249AMethod of making mold-packaged pressure sensing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 13, 1995·56 cites·18 claims
- 0366US5394751AMethod of producing semiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Mar 7, 1995·38 cites·4 claims
- 0465US5202281AMethod of manufacturing silicon semiconductor acceleration sensor devicesMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Apr 13, 1993·24 cites·2 claims
- 0553US6958529B2Acceleration sensor and method of manufacture thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 25, 2005·6 cites·8 claims
- 0653US6900071B2Substrate and method for producing the same, and thin film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 31, 2005·4 cites·8 claims
- 0748US4700545ARefrigerating systemAISIN SEIKI·Filed 1986·Granted Oct 20, 1987·14 cites·5 claims
- 0848US2009025839A1High tensile strength, refractory steel having excellent weldability and gas cuttability and method for producing sameNIPPON STEEL CORP·Filed 2006·Application pending·0 cites
- 0946US6812568B2Electrode structure, and method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 2, 2004·3 cites·20 claims
- 1043US7041593B2Method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 9, 2006·2 cites·9 claims
- 1143US6905905B2Method of manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 14, 2005·2 cites·10 claims
- 1240US6784011B2Method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 31, 2004·2 cites·6 claims
- 1336US4891951ARefrigeration systemAISIN SEIKI·Filed 1988·Granted Jan 9, 1990·9 cites·6 claims
- 1432US4924286ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted May 8, 1990·3 cites·5 claims
- 1532US4400682APressure sensorMITSUBISHI ELECTRIC CORP·Filed 1981·Granted Aug 23, 1983·3 cites·2 claims
- 1632US4283838AMethod of making plastic encapsulated semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1979·Granted Aug 18, 1981·5 cites·5 claims
- 1731US4907412ARefrigeratorAISIN SEIKI·Filed 1987·Granted Mar 13, 1990·3 cites·9 claims
- 1827US7371600B2Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 13, 2008·0 cites·9 claims
- 1927US4570445AMethod of absorbing thermal energy at low temperatureAISIN SEIKI·Filed 1984·Granted Feb 18, 1986·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →