Inventor · disambiguated record
Kishan Jayanand
Also filed as: JAYANAND KISHAN
0 granted patents·12 pending applications·0 citations·filing 2023–2024
Files withIBM12
Top patents by PatentIndex Score
12 records- 0160US2025385204A1Structures and materials for reducing in-plane stresses and voids - creating an optimized hybrid bonding interfaceIBM·Filed 2024·Application pending·0 cites
- 0259US2025096125A1Antifuse and resistorIBM·Filed 2023·Application pending·0 cites
- 0358US2025379166A1Repair structure for bonded semiconductor deviceIBM·Filed 2024·Application pending·0 cites
- 0458US2025329671A1Resistance temperature detector at hybrid bonding interfaceIBM·Filed 2024·Application pending·0 cites
- 0556US2025201775A1High capacitance hybrid bonded capacitor deviceIBM·Filed 2023·Application pending·0 cites
- 0656US2025316578A1Inductor-capacitor circuit structure at hybrid bonding interfaceIBM·Filed 2024·Application pending·0 cites
- 0755US2025323119A1Thermoelectric cooling structure at a hybrid bonding interfaceIBM·Filed 2024·Application pending·0 cites
- 0853US2025391781A1Dual-signature structure to verify authenticity in microelectronicsIBM·Filed 2024·Application pending·0 cites
- 0953US2025391772A1Integrated circuit resistive structure validation for authenticationIBM·Filed 2024·Application pending·0 cites
- 1051US2025140609A1Negative-tone organic dielectric with fine metal pillar resolutionIBM·Filed 2023·Application pending·0 cites
- 1149US2025004208A1Photonic optical fiber packagingIBM·Filed 2023·Application pending·0 cites
- 1247US2025391786A1Piezoelectric-based authentication for counterfeit prevention in microelectronicsIBM·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →