Inventor · disambiguated record
Kiseok Kim
Also filed as: KIM KISEOK
4 granted patents·14 pending applications·9 citations·filing 2006–2024
64Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11LG ELECTRONICS INC3APTAMER SCIENCES INC1MASSACHUSETTS INST TECHNOLOGY1NORBECK JOSEPH M1
Top patents by PatentIndex Score
18 records- 0174US8603430B2Controlling the synthesis gas composition of a steam methane reformerNORBECK JOSEPH M·Filed 2009·Granted Dec 10, 2013·4 cites·15 claims
- 0269US8349288B2Process for enhancing the operability of hot gas cleanup for the production of synthesis gas from steam-hydrogasification producer gasUNIV CALIFORNIA·Filed 2006·Granted Jan 8, 2013·5 cites·13 claims
- 0360US11953983B2Electronic device and method for initializing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0460US2025204109A1Display device having a semiconductor light-emitting deviceLG ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0559US2024337392A1Air conditioning deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025132202A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2025125205A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0857US2025201749A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0956US2024071759A1Confined Growth of 2D Materials and Their HeterostructuresMASSACHUSETTS INST TECHNOLOGY·Filed 2023·Application pending·0 cites
- 1056US2025105133A1Semiconductor package including insulating materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1156US2025167153A1Method of forming redistribution pad and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1254US2024194553A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1352US2024194582A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1451US12154935B2Display device using semiconductor light emitting element and black dye layersLG ELECTRONICS INC·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1548US2024266188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1646US2024372047A1Display deviceLG ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 1745US2023112891A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1840US2022098638A1Multiplex pcr method using aptamerAPTAMER SCIENCES INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →