Inventor · disambiguated record
Ki Hyeon Kim
Also filed as: KIM KI HYEON
5 granted patents·9 pending applications·21 citations·filing 2001–2025
70Inventor score
Files withHYUNDAI MOBIS CO LTD5LS ELECTRIC CO LTD2PARK MYUNG-BEOM2SAMSUNG ELECTRONICS CO LTD2GWANGJU INST SCIENCE & TECH1
Top patents by PatentIndex Score
14 records- 0176US6649286B2FeCoNiN-based soft magnetic thin film compositionKOREA INST SCI & TECH·Filed 2001·Granted Nov 18, 2003·19 cites·2 claims
- 0269US2025253420A1Battery module assembly and method for manufacturing battery module assemblyHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 0364US2023344025A1Battery module assembly and method for manufacturing battery module assemblyHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 0462US11637338B2Battery module assembly and assembling method thereofHYUNDAI MOBIS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 0561US2023055817A1Lower case of battery module having cooling block and manufacturing method thereofHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 0660US2023261329A1Battery moduleHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 0756US2025130114A1Sensor deviceLS ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0854US2025076088A1Wireless sensor deviceLS ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0953US9562299B2Copper electroplating solution and copper electroplating apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·9 claims
- 1051US9929475B2Waveband electromagnetic wave absorber and method for manufacturing sameLEE SANG KWAN·Filed 2011·Granted Mar 27, 2018·2 cites·12 claims
- 1140US2025348090A1Unmanned aerial vehicle formation control system and method thereforGWANGJU INST SCIENCE & TECH·Filed 2022·Application pending·0 cites
- 1238US2007287280A1Composition for removing a photoresist and method of forming a bump electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1331US8795505B2Copper electroplating methodPARK MYUNG-BEOM·Filed 2011·Granted Aug 5, 2014·0 cites·14 claims
- 1430US2012193238A1Compositions For Plating Copper And Methods Of Forming A Copper Bump Using The SamePARK MYUNG-BEOM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →