Inventor · disambiguated record
Kiyonori Kogawa
Also filed as: KOGAWA KIYONORI
6 granted patents·363 citations·filing 1986–1994
88Inventor score
Top patents by PatentIndex Score
6 records- 0193US4642161AMethod of bonding copper and resinHITACHI LTD·Filed 1986·Granted Feb 10, 1987·113 cites·11 claims
- 0291US5021296ACircuit board and process for producing the sameHITACHI LTD·Filed 1989·Granted Jun 4, 1991·66 cites·33 claims
- 0388US5182121AHot pressHITACHI LTD·Filed 1990·Granted Jan 26, 1993·40 cites·2 claims
- 0486US4970107AComposite article comprising a copper element and a process for producing itHITACHI LTD·Filed 1989·Granted Nov 13, 1990·50 cites·34 claims
- 0582US5496433AHot press for use in production of multilayered substrateHITACHI TECHNO ENG·Filed 1993·Granted Mar 5, 1996·54 cites·5 claims
- 0675US5472563APrinted circuit board and method and apparatus for making sameHITACHI LTD·Filed 1994·Granted Dec 5, 1995·40 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →