Inventor · disambiguated record
Kiju Lee
Also filed as: LEE KIJU
5 granted patents·10 pending applications·3 citations·filing 2012–2025
66Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7UNIV CASE WESTERN RESERVE4TEXAS A & M UNIV SYS2LEE KIJU1SAMSUNG ELECTRO MECH1
Top patents by PatentIndex Score
15 records- 0183US11183075B2Automated assessment of cognitive, fine-motor, and memory skillsUNIV CASE WESTERN RESERVE·Filed 2020·Granted Nov 23, 2021·2 cites·3 claims
- 0263US2025332709A1Cycloidal legs-augmented wheels for stair and obstacle climbing in mobile robotsTEXAS A & M UNIV SYS·Filed 2025·Application pending·0 cites
- 0360US9968296B2Wearable socio-biosensor deviceUNIV CASE WESTERN RESERVE·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 0459US11824033B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 21, 2023·0 cites·20 claims
- 0559US2025149515A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025157902A1Semiconductor package including a conductive pillarSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0757US2025167128A1Semiconductor package including a solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0855US12103331B2Transformable wheel and leg assemblyUNIV CASE WESTERN RESERVE·Filed 2021·Granted Oct 1, 2024·0 cites·18 claims
- 0955US2012258436A1Automated assessment of cognitive, fine-motor, and memory skillsLEE KIJU·Filed 2012·Application pending·0 cites
- 1055US2024145444A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US11552038B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1252US2017018198A1Automated assessment of cognitive, fine-motor, and memory skillsUNIV CASE WESTERN RESERVE·Filed 2016·Application pending·0 cites
- 1350US2024181805A1Wheel and leg transformable robot with suspension and autonomous navigationTEXAS A & M UNIV SYS·Filed 2022·Application pending·0 cites
- 1447US2023115957A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1539US2014103098A1Mask for bumping solder balls on circuit board and solder ball bumping method using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →