Inventor · disambiguated record
Ki-Man Lee
Also filed as: LEE KI-MAN
8 granted patents·5 pending applications·2 citations·filing 2003–2023
74Inventor score
Top patents by PatentIndex Score
13 records- 0178US10021451B2Method for outputting audio and electronic device for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 10, 2018·2 cites·11 claims
- 0273US2024056629A1Method for outputting audio and electronic device for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0363US11818423B2Method for outputting audio and electronic device for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 14, 2023·0 cites·21 claims
- 0456US10904612B2Method for outputting audio and electronic device for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 26, 2021·0 cites·14 claims
- 0555US2021014180A1Method for bookmark function applicable in messenger application and electronic apparatus thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 0649US12246361B2Pod cleaning chamberSTI CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·14 claims
- 0747US12330192B2POD cleaning deviceSTI CO LTD·Filed 2021·Granted Jun 17, 2025·0 cites·14 claims
- 0847US12251736B2Pod cleaning processSTI CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·10 claims
- 0946US2013262599A1Method for bookmark function applicable in messenger application and electronic apparatus thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1044US9373698B2Methods of manufacturing semiconductor devices and electronic devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 21, 2016·0 cites·20 claims
- 1135US2005180859A1Four-in pumpFiled 2003·Application pending·0 cites
- 1231US2016025484A1Overlay measurement device and method and method of forming overlay patternSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1327US9379019B2Methods of manufacturing a semiconductor deviceYOUN BUM-JOON·Filed 2015·Granted Jun 28, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →