Inventor · disambiguated record
Ki Ill Moon
Also filed as: MOON KI ILL
5 granted patents·5 pending applications·126 citations·filing 2002–2025
82Inventor score
Top patents by PatentIndex Score
10 records- 0188US6818474B2Method for manufacturing stacked chip packageHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Nov 16, 2004·76 cites·5 claims
- 0285US9515052B1Semiconductor package including a step type substrateSK HYNIX INC·Filed 2015·Granted Dec 6, 2016·9 cites·20 claims
- 0381US9842809B2Semiconductor packages having EMI shielding parts and methods of fabricating the sameSK HYNIX INC·Filed 2016·Granted Dec 12, 2017·6 cites·19 claims
- 0476US6841863B2Ball grid array package with stacked center pad chips and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Jan 11, 2005·24 cites·6 claims
- 0562US7115442B2Ball grid array package with stacked center pad chips and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2004·Granted Oct 3, 2006·11 cites·5 claims
- 0658US2025022869A1Methods of manufacturing semiconductor die stack structuresSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0757US2024395746A1Semiconductor die having a metal plate layerSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0852US2019027378A1Methods of fabricating package substrates having embedded circuit patternsSK HYNIX INC·Filed 2018·Application pending·0 cites
- 0947US2025167123A1Semiconductor die having a metal plate layerSK HYNIX INC·Filed 2025·Application pending·0 cites
- 1046US2017053813A1Methods of fabricating package substrates having embedded circuit patternsSK HYNIX INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →