Inventor · disambiguated record
Kimio Nakamura
Also filed as: NAKAMURA KIMIO
29 granted patents·16 pending applications·377 citations·filing 1977–2018
96Inventor score
Files withFUJITSU LTD17HITACHI LTD11HITACHI KOKI KK3HITACHI CONSUMER ELECTRONICS1HITACHI GLOBAL STORAGE TECH NL1
Top patents by PatentIndex Score
45 records- 0189US5796706AInformation recording apparatusHITACHI LTD·Filed 1997·Granted Aug 18, 1998·59 cites·4 claims
- 0287US6683823B2Method for reproducing information on a recording mediumHITACHI LTD·Filed 2002·Granted Jan 27, 2004·22 cites·3 claims
- 0386US7864475B2Thermally assisted magnetic recording system and thermally assisted magnetic recordingHITACHI LTD·Filed 2008·Granted Jan 4, 2011·7 cites·14 claims
- 0484US7773331B2Thermally assisted magnetic recording systemHITACHI LTD·Filed 2007·Granted Aug 10, 2010·6 cites·13 claims
- 0584US5181141AAnti-reflection optical elementHOYA CORP·Filed 1992·Granted Jan 19, 1993·74 cites·11 claims
- 0683US8679654B2Magnetic recording medium including plural FePt alloy layers including carbon, oxides or nitridesNEMOTO HIROAKI·Filed 2012·Granted Mar 25, 2014·3 cites·10 claims
- 0783US7804743B2Thermally assisted magnetic recording head and method of manufacturing the sameHITACHI LTD·Filed 2009·Granted Sep 28, 2010·4 cites·4 claims
- 0878US7898908B2Head for thermally assisted magnetic recording device and thermally assisted magnetic recording deviceHITACHI LTD·Filed 2006·Granted Mar 1, 2011·3 cites·12 claims
- 0978US6304527B1Near-field optical head and manufacturing method thereof and optical recording/readout system using near-field optical headHITACHI LTD·Filed 1999·Granted Oct 16, 2001·71 cites·24 claims
- 1076US8381963B2Compression-bonding apparatusFUJITSU LTD·Filed 2010·Granted Feb 26, 2013·4 cites·10 claims
- 1176US7566586B2Method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·7 cites·11 claims
- 1275US4065598AProcess for polymeric modification of a fiberTORAY INDUSTRIES·Filed 1977·Granted Dec 27, 1977·31 cites·33 claims
- 1374US8351144B2Thermally assisted magnetic recording head, recording system, and recording methodHITACHI GLOBAL STORAGE TECH NL·Filed 2008·Granted Jan 8, 2013·2 cites·20 claims
- 1471US6930846B2Magnetic recording apparatus and system for driving a magnetic recording mediumHITACHI LTD·Filed 2003·Granted Aug 16, 2005·8 cites·6 claims
- 1570US8186615B2Rotor head of remotely-controlled helicopter and remotely-controlled helicopterUEBORI TAKAKAZU·Filed 2007·Granted May 29, 2012·6 cites·6 claims
- 1666US7670873B2Method of flip-chip mountingFUJITSU LTD·Filed 2006·Granted Mar 2, 2010·3 cites·1 claims
- 1762US4323837APower supply circuit for automotive vehiclesNISSAN MOTOR·Filed 1979·Granted Apr 6, 1982·28 cites·4 claims
- 1858US8355310B2Optical information recording methodHITACHI CONSUMER ELECTRONICS·Filed 2009·Granted Jan 15, 2013·0 cites·3 claims
- 1958US7712650B2Method of mounting a semiconductor chipFUJITSU LTD·Filed 2006·Granted May 11, 2010·1 cites·5 claims
- 2058US4737923AType arrangement data editing apparatusHITACHI KOKI KK·Filed 1983·Granted Apr 12, 1988·15 cites·5 claims
- 2155US2006221482A1Thermally assisted magnetic recording head and method of manufacturing the sameMATSUMOTO TAKUYA·Filed 2006·Application pending·0 cites
- 2251US7367108B2Method of bonding flying leadsFUJITSU LTD·Filed 2006·Granted May 6, 2008·0 cites·8 claims
- 2350US6744249B2Method and instrument for measuring a magnetic field, a method for measuring a current waveform, and method for measuring an electric fieldHITACHI LTD·Filed 2002·Granted Jun 1, 2004·1 cites·20 claims
- 2450US2010095515A1Method and apparatus for assembling a carriage assemblyTOSHIBA STORAGE DEVICE CORP·Filed 2007·Application pending·0 cites
- 2549USD305130SLine printer for a computerHITACHI KOKI KK·Filed 1986·Granted Dec 19, 1989·6 cites·1 claims
- 2649US2013249087A1Electronic component and manufacture method thereofFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2747US5179412ATransfer unit for xerographic printing machine with constant ventilating interiorHITACHI KOKI KK·Filed 1991·Granted Jan 12, 1993·7 cites·7 claims
- 2845US9391031B2Method for manufacturing electronic device and electronic deviceFUJITSU LTD·Filed 2013·Granted Jul 12, 2016·0 cites·7 claims
- 2945US6560168B1Information recording/reproducing deviceHITACHI LTD·Filed 1998·Granted May 6, 2003·6 cites·28 claims
- 3044US7582553B2Method of bonding flying leadsFUJITSU LTD·Filed 2006·Granted Sep 1, 2009·0 cites·9 claims
- 3144US2010327435A1Electronic component and manufacture method thereofFUJITSU LTD·Filed 2010·Application pending·0 cites
- 3242US2013255878A1Printed circuit board manufacturing methodFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3342US2001001607A1Information recording and reproducing apparatus and method of recording and reproducing information using solid immersion lens having super resolution film deposited thereonFiled 2001·Application pending·0 cites
- 3441US2009320270A1Method and apparatus for assembling a carriage assemblyISHIKAWA NAOKI·Filed 2007·Application pending·0 cites
- 3540US7416921B2Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resinFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·0 cites·4 claims
- 3640US2012230001A1Electronic device, portable electronic terminal, and method of manufacturing electronic deviceTAKAHASHI TETSUYA·Filed 2012·Application pending·0 cites
- 3740US2007137025A1Method of bonding flying leadsFUJITSU LTD·Filed 2006·Application pending·0 cites
- 3840US2018358320A1Electronic device, electronic device manufacturing method, and electronic apparatusFUJITSU LTD·Filed 2018·Application pending·0 cites
- 3939US6298029B1Information recording and reproducing apparatus and methods of recording and reproducing information using solid immersion lens having super resolution film deposited thereonHITACHI LTD·Filed 1998·Granted Oct 2, 2001·3 cites·6 claims
- 4039US2012080220A1Electronic device, circuit board, and manufacturing method of electronic deviceNAKAMURA KIMIO·Filed 2011·Application pending·0 cites
- 4138US2017357063A1Optical module and optical module manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 4237US2011079896A1Semiconductor device and semiconductor device fabrication methodFUJITSU LTD·Filed 2010·Application pending·0 cites
- 4336US2016372441A1Semiconductor device and manufacturing method of semiconductor deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 4435US2017020000A1Component-mounted board, method of manufacturing component-mounted board and component-embedded boardFUJITSU LTD·Filed 2016·Application pending·0 cites
- 4532US2012052330A1Perpendicular magnetic recording medium and manufacturing method of the sameTAKEKUMA IKUKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →