Inventor · disambiguated record
Kiyotaka Nakaya
Also filed as: NAKAYA KIYOTAKA
26 granted patents·10 pending applications·4 citations·filing 2011–2022
90Inventor score
Top patents by PatentIndex Score
36 records- 0188US10047448B2Tin-plated copper-alloy terminal materialMITSUBISHI MATERIALS CORP·Filed 2015·Granted Aug 14, 2018·2 cites·2 claims
- 0284US10858750B2Tin-plated copper terminal material, terminal and electric wire terminal-end structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 0376US10407785B2Additive for high-purity copper electrolytic refining and method of producing high-purity copperMITSUBISHI MATERIALS CORP·Filed 2015·Granted Sep 10, 2019·1 cites·16 claims
- 0471US11753733B2Method for producing high-purity electrolytic copperMITSUBISHI MATERIALS CORP·Filed 2018·Granted Sep 12, 2023·0 cites·8 claims
- 0567US11453953B2High-purity electrolytic copperMITSUBISHI MATERIALS CORP·Filed 2018·Granted Sep 27, 2022·0 cites·8 claims
- 0663US11264750B2Tin-plated copper terminal material, terminal, and electric-wire terminal structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Mar 1, 2022·0 cites·10 claims
- 0761US11530490B2Terminal material with silver coating film and terminal with silver coating filmMITSUBISHI MATERIALS CORP·Filed 2018·Granted Dec 20, 2022·0 cites·12 claims
- 0859US2015184302A1Tin-plated copper-alloy terminal materialMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites
- 0958US11661667B2Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted May 30, 2023·0 cites·19 claims
- 1058US11088472B2Tin-plated copper terminal material, terminal, and wire terminal part structureMITSUBISHI MATERIALS CORP·Filed 2016·Granted Aug 10, 2021·0 cites·6 claims
- 1158US10801115B2Tinned copper terminal material, terminal, and electrical wire end part structureMITSUBISHI MATERIALS CORP·Filed 2017·Granted Oct 13, 2020·0 cites·8 claims
- 1257US11572633B2Tin-plated copper terminal material and method of manufacturing the sameMITSUBISHI MATERIALS CORP·Filed 2019·Granted Feb 7, 2023·0 cites·6 claims
- 1357US2024321806A1Bonding paste, bonding layer, bonded body, and method for producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 1456US2024165699A1Copper particles and method for producing sameMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 1554US10358730B2Additive for high-purity copper electrolytic refining and method of producing high-purity copperMITSUBISHI MATERIALS CORP·Filed 2015·Granted Jul 23, 2019·0 cites·14 claims
- 1654US9783904B2High-purity electrolytic copper and electrolytic refining method thereofMITSUBISHI MATERIALS CORP·Filed 2013·Granted Oct 10, 2017·0 cites·2 claims
- 1752US2023027568A1Method of producing copper oxide powder, and copper oxide powderMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 1851US11211729B2Terminal material for connectors, terminal, and electric wire termination structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Dec 28, 2021·0 cites·7 claims
- 1950US11174565B2Plating liquidMITSUBISHI MATERIALS CORP·Filed 2018·Granted Nov 16, 2021·0 cites·16 claims
- 2050US10923245B2Terminal material for connectors and method for producing sameMITSUBISHI SHINDO KK·Filed 2018·Granted Feb 16, 2021·0 cites·7 claims
- 2150US10428434B2Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copperMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 1, 2019·0 cites·13 claims
- 2249US10793956B2Additive for high-purity copper electrolytic refining and method of producing high-purity copperMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 6, 2020·0 cites·16 claims
- 2349US10329680B2Plating solution using sulfonium saltMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jun 25, 2019·0 cites·4 claims
- 2449US10174434B2Plating solution using phosphonium saltMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jan 8, 2019·0 cites·4 claims
- 2548US10301737B2Method of manufacturing tin-plated copper terminal materialMITSUBISHI MATERIALS CORP·Filed 2016·Granted May 28, 2019·0 cites·3 claims
- 2647US12226820B2Bonding sheetMITSUBISHI MATERIALS CORP·Filed 2021·Granted Feb 18, 2025·0 cites·12 claims
- 2747US10910130B2Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structureMITSUBISHI MATERIALS CORP·Filed 2018·Granted Feb 2, 2021·0 cites·12 claims
- 2845US2015308009A1Phosphorous-containing copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating methodNAKAYA KIYOTAKA·Filed 2011·Application pending·0 cites
- 2944US2022069498A1Connector terminal material and terminal for connectorMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 3042US2023038219A1Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 3142US2021352828A1Metal layer-including carbonaceous member and heat conduction plateMITSUBISHI MATERIALS CORP·Filed 2019·Application pending·0 cites
- 3241US10450665B2Plating solution using ammonium saltMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 22, 2019·0 cites·10 claims
- 3341US2013075272A1Highly pure copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating methodNAKAYA KIYOTAKA·Filed 2011·Application pending·0 cites
- 3441US2022085526A1Anti-corrosion terminal material, terminal, and electrical wire end section structureMITSUBISHI MATERIALS CORP·Filed 2019·Application pending·0 cites
- 3536US11268203B2Tin or tin alloy plating solutionMITSUBISHI MATERIALS CORP·Filed 2018·Granted Mar 8, 2022·0 cites·8 claims
- 3634US11162182B2Tin or tin alloy plating solutionMITSUBISHI MATERIALS CORP·Filed 2018·Granted Nov 2, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →