Inventor · disambiguated record
Kiyotoshi Nishida
Also filed as: NISHIDA KIYOTOSHI
3 granted patents·17 citations·filing 1996–1999
68Inventor score
Top patents by PatentIndex Score
3 records- 0140US6077365ABeryllium-copper bonding materialAGENCY IND SCIENCE TECHN·Filed 1999·Granted Jun 20, 2000·7 cites·11 claims
- 0238US5895533ABeryllium-copper bonding materialJAPAN ATOMIC ENERGY RES INST·Filed 1996·Granted Apr 20, 1999·6 cites·8 claims
- 0331US5958105AProcess for preparing metallic beryllium pebblesJAPAN ATOMIC ENERGY RES INST·Filed 1997·Granted Sep 28, 1999·4 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Kiyotoshi Nishida files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →