Inventor · disambiguated record
King Hoo Ong
Also filed as: ONG KING HOO
5 granted patents·47 citations·filing 2005–2013
77Inventor score
Files withCARSEM M SDN BHD1CHIEN JACK CHANG1RAI PRADEEP KUMAR1SANDISK CORP1SANDISK SEMICONDUCTOR SHANGHAI CO LTD1
Top patents by PatentIndex Score
5 records- 0186US7273767B2Method of manufacturing a cavity packageCARSEM M SDN BHD·Filed 2005·Granted Sep 25, 2007·31 cites·24 claims
- 0283US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0373US8499813B2System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2012·Granted Aug 6, 2013·6 cites·20 claims
- 0454US7745234B2Method for reclaiming semiconductor packageSANDISK CORP·Filed 2008·Granted Jun 29, 2010·1 cites·24 claims
- 0552US9038264B2Non-uniform vacuum profile die attach tipRAI PRADEEP KUMAR·Filed 2011·Granted May 26, 2015·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →