Inventor · disambiguated record
Kiyotaka Seyama
Also filed as: SEYAMA KIYOTAKA
14 granted patents·444 citations·filing 1987–2008
94Inventor score
Files withFUJITSU LTD14
Top patents by PatentIndex Score
14 records- 0186US6693362B2Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrateFUJITSU LTD·Filed 2001·Granted Feb 17, 2004·42 cites·7 claims
- 0283US5862038ACooling device for mounting moduleFUJITSU LTD·Filed 1997·Granted Jan 19, 1999·77 cites·14 claims
- 0378US5894882AHeat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structureFUJITSU LTD·Filed 1996·Granted Apr 20, 1999·60 cites·17 claims
- 0478US5586006AMulti-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked togetherFUJITSU LTD·Filed 1995·Granted Dec 17, 1996·59 cites·32 claims
- 0578US5432675AMulti-chip module having thermal contactsFUJITSU LTD·Filed 1993·Granted Jul 11, 1995·63 cites·13 claims
- 0672US7377030B2Wiring board manufacturing methodFUJITSU LTD·Filed 2005·Granted May 27, 2008·6 cites·6 claims
- 0765US4912603AHigh density printed wiring boardFUJITSU LTD·Filed 1989·Granted Mar 27, 1990·32 cites·14 claims
- 0864US5608192AMultilayer thin-film wiring boardFUJITSU LTD·Filed 1995·Granted Mar 4, 1997·32 cites·15 claims
- 0962US4949219AModule sealing structureFUJITSU LTD·Filed 1989·Granted Aug 14, 1990·27 cites·10 claims
- 1058US6959125B2Printed board unit for optical transmission and mounting methodFUJITSU LTD·Filed 2003·Granted Oct 25, 2005·9 cites·8 claims
- 1155US7935891B2Wiring board manufacturing methodFUJITSU LTD·Filed 2008·Granted May 3, 2011·0 cites·1 claims
- 1248US5166867ABus bar for a circuit boardFUJITSU LTD·Filed 1987·Granted Nov 24, 1992·14 cites·18 claims
- 1346US6057168AMethod for forming bumps using dummy waferFUJITSU LTD·Filed 1999·Granted May 2, 2000·14 cites·9 claims
- 1437US5181317AMethod of making an engineering change to a printed wiring boardFUJITSU LTD·Filed 1991·Granted Jan 26, 1993·9 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →