Inventor · disambiguated record
Ki Tae Song
Also filed as: SONG KI TAE
6 granted patents·8 pending applications·23 citations·filing 2008–2015
76Inventor score
Top patents by PatentIndex Score
14 records- 0186US8623512B2Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive filmPYUN AH RAM·Filed 2010·Granted Jan 7, 2014·9 cites·16 claims
- 0282US8557896B2Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding filmJEONG CHUL·Filed 2010·Granted Oct 15, 2013·12 cites·19 claims
- 0358US9109147B2Adhesive composition for semiconductor and adhesive film comprising the samePARK BAEK SOUNG·Filed 2013·Granted Aug 18, 2015·1 cites·18 claims
- 0454US8609515B2Dicing die bonding film, semiconductor wafer, and semiconductor deviceHWANG MIN KYU·Filed 2011·Granted Dec 17, 2013·1 cites·11 claims
- 0545US2009141472A1Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0645US2016075920A1Adhesive film for semiconductor deviceSAMSUNG SDI CO LTD·Filed 2015·Application pending·0 cites
- 0742US8946343B2Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the filmPARK BAEK SOUNG·Filed 2012·Granted Feb 3, 2015·0 cites·21 claims
- 0841US2011159284A1Adhesive composition for semiconductor device and die attach filmCHOI JAE WON·Filed 2010·Application pending·0 cites
- 0940US2009136748A1Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 1038US2012141786A1Adhesive film for semiconductor deviceUH DONG SEON·Filed 2011·Application pending·0 cites
- 1135US2012029117A1Adhesive film for semiconductor assemblyCHOI HAN NIM·Filed 2011·Application pending·0 cites
- 1234US8243870B2Apparatus for removing thermal sleeve from cold leg of reactor coolant systemBAEK WON JONG·Filed 2010·Granted Aug 14, 2012·0 cites·10 claims
- 1334US2011159294A1Attach film composition for semiconductor assembly and attach film using the sameSONG GYU SEOK·Filed 2010·Application pending·0 cites
- 1433US2013273355A1Dicing die bonding filmUH DONG SEON·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →