Inventor · disambiguated record
Kim Hwee Tan
Also filed as: TAN KIM H · TAN KIM HENG · TAN KIM HWEE
6 granted patents·4 pending applications·435 citations·filing 1999–2010
85Inventor score
Files withADVANPACK SOLUTIONS PTE LTD4AGERE SYST GUARDIAN CORP1CHOPIN SHEILA F1HAMAMOTO MITCHELL M1LUCENT TECHNOLOGIES INC1
Top patents by PatentIndex Score
10 records- 0196US6550666B2Method for forming a flip chip on leadframe semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Apr 22, 2003·250 cites·23 claims
- 0289US7462942B2Die pillar structures and a method of their formationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Granted Dec 9, 2008·149 cites·59 claims
- 0360US7541251B2Wire bond and redistribution layer processMICRO DEVICES CORP CALIFORNIA·Filed 2006·Granted Jun 2, 2009·3 cites·11 claims
- 0458US6319450B1Encapsulated circuit using vented moldAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 20, 2001·26 cites·4 claims
- 0556US8058712B2Device having wire bond and redistribution layerHAMAMOTO MITCHELL M·Filed 2010·Granted Nov 15, 2011·2 cites·4 claims
- 0638US2006060937A1Embedded passive componentADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 0735US2007031996A1Packaged integrated circuit having a heat spreader and method thereforCHOPIN SHEILA F·Filed 2004·Application pending·0 cites
- 0834US2004108580A1Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 0931US6199464B1Method and apparatus for cutting a substrateLUCENT TECHNOLOGIES INC·Filed 1999·Granted Mar 13, 2001·5 cites·23 claims
- 1029US2003160311A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →