Inventor · disambiguated record
Kiyonori Watanabe
Also filed as: WATANABE KIYONORI
16 granted patents·5 pending applications·63 citations·filing 2001–2013
91Inventor score
Top patents by PatentIndex Score
21 records- 0184US7847407B2Semiconductor device with interface peeling preventing rewiring layerOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Dec 7, 2010·11 cites·6 claims
- 0277US7582972B2Semiconductor device and fabrication method thereofOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Sep 1, 2009·6 cites·3 claims
- 0375US8110923B2Semiconductor device and method of manufacturing the sameWATANABE KIYONORI·Filed 2010·Granted Feb 7, 2012·5 cites·20 claims
- 0475US7626271B2Semiconductor device and method of producing the sameOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Dec 1, 2009·6 cites·4 claims
- 0575US7446414B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2006·Granted Nov 4, 2008·7 cites·10 claims
- 0669US7781338B2Semiconductor device manufacturing method and semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Aug 24, 2010·4 cites·4 claims
- 0767US6458682B2Method of manufacturing a bump electrode semiconductor device using photosensitive resinOKI ELECTRIC IND CO LTD·Filed 2001·Granted Oct 1, 2002·16 cites·17 claims
- 0866US7879714B2Semiconductor device manufacturing methodOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Feb 1, 2011·3 cites·8 claims
- 0963US7534664B2Semiconductor device and method of manufacturing sameOKI ELECTRIC IND CO LTD·Filed 2007·Granted May 19, 2009·2 cites·24 claims
- 1060US7884008B2Semiconductor device fabrication methodOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Feb 8, 2011·1 cites·11 claims
- 1158US7741705B2Semiconductor device and method of producing the sameOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Jun 22, 2010·1 cites·6 claims
- 1256US8212362B2Semiconductor deviceWATANABE KIYONORI·Filed 2009·Granted Jul 3, 2012·1 cites·6 claims
- 1353US2013313703A1Semiconductor device having wafer-level chip size packageOKI SEMICONDUCTOR CO LTD·Filed 2013·Application pending·0 cites
- 1449US2011089562A1Semiconductor device having wafer-level chip size packageOKI SEMICONDUCTOR CO LTD·Filed 2010·Application pending·0 cites
- 1547US8039310B2Method of manufacturing semiconductor device with improved design freedom of external terminalOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Oct 18, 2011·0 cites·4 claims
- 1646US2006163058A1Apparatus for plating a semiconductor wafer and plating solution bath used thereinWATANABE KIYONORI·Filed 2005·Application pending·0 cites
- 1745US8274154B2Semiconductor device with interface peeling preventing rewiring layerWATANABE KIYONORI·Filed 2010·Granted Sep 25, 2012·0 cites·7 claims
- 1842US2010283150A1Semiconductor deviceWATANABE KIYONORI·Filed 2010·Application pending·0 cites
- 1942US2010221910A1Method of producing semiconductor deviceWATANABE KIYONORI·Filed 2010·Application pending·0 cites
- 2041US7282800B2Semiconductor device and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 16, 2007·0 cites·15 claims
- 2140US7109579B2Semiconductor device with improved design freedom of external terminalOKI ELECTRIC IND CO LTD·Filed 2003·Granted Sep 19, 2006·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →