Inventor · disambiguated record
Ki-Myung Yoon
Also filed as: YOON KI-MYUNG
1 granted patent·13 pending applications·1 citations·filing 2003–2024
15Inventor score
Top patents by PatentIndex Score
14 records- 0169US11728317B2Power module packagePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2021·Granted Aug 15, 2023·1 cites·15 claims
- 0249US2024290759A1Semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0348US2024213126A1Semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0448US2024222255A1Semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0548US2024213208A1Semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0645US2008138934A1Method of manufacturing multi-stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0743US2024014106A1Semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0841US2025233032A1Double-sided cooling semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0940US2024387313A1Both-surface cooling semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1037US2005233567A1Method of manufacturing multi-stack packageKIM SE-NYUN·Filed 2005·Application pending·0 cites
- 1135US2022254700A1Packaged power semiconductor devicePOWER MASTER SEMICONDUCTOR CO LTD·Filed 2021·Application pending·0 cites
- 1232US2005200003A1Multi-chip packageFiled 2005·Application pending·0 cites
- 1327US2005081986A1Die bonding apparatus and method for bonding semiconductor chip using the sameFiled 2004·Application pending·0 cites
- 1413US2004125574A1Multi-chip semiconductor package and method for manufacturing the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →