Inventor · disambiguated record
Klaus Dippon
Also filed as: DIPPON KLAUS
2 granted patents·17 citations·filing 2007–2009
57Inventor score
Top patents by PatentIndex Score
2 records- 0168US8241739B2Sheet molding compounds (SMC), thick molding compounds (TMC), and bulk molding compounds (BMC) comprising thermosetting resins based on renewable resourcesSCHONFELD UWE·Filed 2007·Granted Aug 14, 2012·14 cites·14 claims
- 0259US9279054B2Sound-absorbent foam systemSCHOENFELD UWE·Filed 2009·Granted Mar 8, 2016·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →