Inventor · disambiguated record
Klaus Hoehn
Also filed as: HOEHN KLAUS
7 granted patents·4 pending applications·74 citations·filing 1994–2020
82Inventor score
Top patents by PatentIndex Score
11 records- 0181US7183661B2Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereofOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2001·Granted Feb 27, 2007·31 cites·25 claims
- 0268US5492981ACasting resin of epoxyalkylsiloxane, epoxy resin and anhyrideSIEMENS AG·Filed 1994·Granted Feb 20, 1996·27 cites·3 claims
- 0354US2022235219A1Resin composition, use of the resin composition, optoelectronic device and method for producing an optoelectronic deviceOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2020·Application pending·0 cites
- 0445US2016307674A1Varistor paste, optoelectronic component, method of producing a varistor paste and method of producing a varistor elementOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Application pending·0 cites
- 0541US9224924B2Optoelectronic component including an adhesive layer and method for producing the sameOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2012·Granted Dec 29, 2015·0 cites·18 claims
- 0641US8878170B2Optoelectronic semiconductor deviceHOEHN KLAUS·Filed 2011·Granted Nov 4, 2014·0 cites·17 claims
- 0741US6245187B1Mechanically firm glued connections between surfaces and the method for producing the sameSIEMENS AG·Filed 1997·Granted Jun 12, 2001·13 cites·24 claims
- 0840US10263164B2Electronic component including a material comprising epdxysilane-modified polyorganosiloxaneOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2016·Granted Apr 16, 2019·0 cites·18 claims
- 0939US2012241694A1Electronic, Especially Optical or Optoelectronic Component, and Method for the Production ThereofHOEHN KLAUS·Filed 2010·Application pending·0 cites
- 1036US2019040250A1Epoxy resin system, use of an epoxy resin system, optoelectronic device, and process for producing an epoxy resin systemOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Application pending·0 cites
- 1131US6207732B1Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-rangeSIEMENS AG·Filed 1997·Granted Mar 27, 2001·3 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →