Inventor · disambiguated record
Klaus-Gunter Oppermann
Also filed as: OPPERMANN KLAUS · OPPERMANN KLAUS-GUENTER · OPPERMANN KLAUS-GUNTER
14 granted patents·2 pending applications·223 citations·filing 1985–2007
93Inventor score
Top patents by PatentIndex Score
16 records- 0188US6762455B2Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 13, 2004·47 cites·9 claims
- 0282US7692317B2Apparatus for housing a micromechanical structureINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 6, 2010·8 cites·2 claims
- 0374US6556418B2Micromechanical component and process for its fabricationINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 29, 2003·20 cites·11 claims
- 0474US4703663AForce sensor for electrical measuring of forces, torques, acceleration pressures and mechanical stressesOPPERMANN KLAUS·Filed 1985·Granted Nov 3, 1987·37 cites·22 claims
- 0570US7300823B2Apparatus for housing a micromechanical structure and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Nov 27, 2007·14 cites·3 claims
- 0664US6401544B2Micromechanical component protected from environmental influencesINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 11, 2002·12 cites·11 claims
- 0764US5994751APhotodiode having reduced series resistance, and method for fabrication thereofSIEMENS AG·Filed 1996·Granted Nov 30, 1999·32 cites·8 claims
- 0863US6955950B2Method for generating a protective cover for a deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 18, 2005·9 cites·20 claims
- 0959US7234237B2Method for producing a protective cover for a deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 26, 2007·8 cites·15 claims
- 1058US6939734B2Method for producing a protective cover for a deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 6, 2005·7 cites·20 claims
- 1154US6373115B1Micromechanical structure, sensor and method for manufacturing the sameSIEMENS AG·Filed 1999·Granted Apr 16, 2002·16 cites·19 claims
- 1253US6724058B2Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the methodINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 20, 2004·3 cites·4 claims
- 1353US6346429B1Method for fabricating integrated sensorsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 12, 2002·6 cites·10 claims
- 1445US6406933B1Production method for micromechanical componentsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jun 18, 2002·4 cites·3 claims
- 1535US2001048139A1Deformation gaugeFiled 2001·Application pending·0 cites
- 1632US2001013773A1Configuration with a plurality of sensor groups and method of determining its intactnessFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →