Inventor · disambiguated record
Klaus Pressel
Also filed as: PRESSEL KLAUS
20 granted patents·1 pending application·341 citations·filing 2004–2020
95Inventor score
Files withINFINEON TECHNOLOGIES AG12PRESSEL KLAUS4INTEL MOBILE COMM GMBH2BRUNNBAUER MARKUS1INTEL DEUTSCHLAND GMBH1
Top patents by PatentIndex Score
21 records- 0198US8952521B2Semiconductor packages with integrated antenna and method of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·90 cites·28 claims
- 0296US8237259B2Embedded chip packagePRESSEL KLAUS·Filed 2007·Granted Aug 7, 2012·46 cites·16 claims
- 0396US7858440B2Stacked semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 28, 2010·44 cites·27 claims
- 0495US8779583B2Semiconductor device and manufacturing methodPRESSEL KLAUS·Filed 2012·Granted Jul 15, 2014·21 cites·20 claims
- 0594US7692588B2Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 6, 2010·41 cites·34 claims
- 0693US9293423B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2014·Granted Mar 22, 2016·11 cites·15 claims
- 0793US7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 30, 2010·30 cites·41 claims
- 0885US8779563B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2012·Granted Jul 15, 2014·6 cites·11 claims
- 0985US8338936B2Semiconductor device and manufacturing methodPRESSEL KLAUS·Filed 2008·Granted Dec 25, 2012·9 cites·19 claims
- 1085US8309454B2Structure for electrostatic discharge in embedded wafer level packagesBRUNNBAUER MARKUS·Filed 2007·Granted Nov 13, 2012·10 cites·14 claims
- 1182US10217695B2Connector block with two sorts of through connections, and electronic device comprising a connector blockINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 26, 2019·3 cites·13 claims
- 1278US7799659B2Singulating semiconductor wafers to form semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 21, 2010·6 cites·15 claims
- 1375US7863728B2Semiconductor module including components in plastic casingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 4, 2011·6 cites·17 claims
- 1472US7659618B2Semiconductor device for radio frequencies of more than 10 GHz and method for producing the deviceINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 9, 2010·5 cites·17 claims
- 1570US7268423B2Flexible rewiring plate for semiconductor components, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·12 cites·17 claims
- 1661US8598709B2Method and system for routing electrical connections of semiconductor chipsMEYER THORSTEN·Filed 2010·Granted Dec 3, 2013·1 cites·24 claims
- 1755US9601475B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL DEUTSCHLAND GMBH·Filed 2016·Granted Mar 21, 2017·0 cites·20 claims
- 1854US11393742B2Method for fabricating a semiconductor flip-chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 1949US7910404B2Method of manufacturing a stacked die moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 22, 2011·0 cites·19 claims
- 2049US7504711B2Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 17, 2009·0 cites·16 claims
- 2148US2012287583A1Embedded chip packagePRESSEL KLAUS·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →