Inventor · disambiguated record
Kouji Akazawa
Also filed as: AKAZAWA KOUJI
7 granted patents·9 pending applications·110 citations·filing 1999–2009
84Inventor score
Top patents by PatentIndex Score
16 records- 0187US7976952B2Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheetNITTO DENKO CORP·Filed 2006·Granted Jul 12, 2011·15 cites·14 claims
- 0282US6258426B1Ultraviolet curing pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 1999·Granted Jul 10, 2001·67 cites·9 claims
- 0381US7514143B2Re-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2004·Granted Apr 7, 2009·17 cites·13 claims
- 0473US7781794B2Resin sheet for encapsulating optical semiconductor element and optical semiconductor deviceNITTO DENKO CORP·Filed 2009·Granted Aug 24, 2010·6 cites·4 claims
- 0567US7777356B2Modified polyaluminosiloxaneNITTO DENKO CORP·Filed 2009·Granted Aug 17, 2010·3 cites·10 claims
- 0658US7951623B2Process for producing optical semiconductor deviceNITTO DENKO CORP·Filed 2008·Granted May 31, 2011·2 cites·8 claims
- 0751US8021756B2Microlens arrayNITTO DENKO CORP·Filed 2009·Granted Sep 20, 2011·0 cites·7 claims
- 0851US2007036930A1Pressure-sensitive adhesive sheet, production method thereof and method of processing articlesNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 0945US2009014750A1Resin for optical semiconductor element encapsulation containing polyborosiloxaneNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1045US2008193728A1Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the sameNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1142US2007059903A1Pressure-sensitive adhesive sheet and method of processing articlesNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 1242US2007071969A1Pressure-sensitive adhesive sheet, production method thereof and method of processing articlesNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 1341US2007054469A1Pressure-sensitive adhesive sheet and method of processing articlesNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 1439US2006257651A1Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with itSHINTANI TOSHIO·Filed 2006·Application pending·0 cites
- 1539US2005153129A1Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the sameNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 1637US2004126575A1Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the sameNITTO DENKO CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →