Inventor · disambiguated record
Koji Akazawa
Also filed as: AKAZAWA KOJI
8 granted patents·7 pending applications·160 citations·filing 1992–2025
85Inventor score
Top patents by PatentIndex Score
15 records- 0193US11649379B2Adhesion method, adhesion-structure, and adhesion kitNITTO DENKO CORP·Filed 2021·Granted May 16, 2023·1 cites·2 claims
- 0284US5304418ADicing-die bonding filmNITTO DENKO CORP·Filed 1992·Granted Apr 19, 1994·86 cites·3 claims
- 0376US5476565ADicing-die bonding filmNITTO DENKO CORP·Filed 1994·Granted Dec 19, 1995·56 cites·1 claims
- 0469US11174415B2Adhesion method, adhesion-structure, and adhesion kitNITTO DENKO CORP·Filed 2016·Granted Nov 16, 2021·0 cites·6 claims
- 0568US7521122B2Laminated sheetNITTO DENKO CORP·Filed 2004·Granted Apr 21, 2009·12 cites·6 claims
- 0666US2020002581A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 0765US2025145870A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0862US9190584B2Optical-semiconductor deviceKONDO TAKASHI·Filed 2011·Granted Nov 17, 2015·1 cites·4 claims
- 0953US8492791B2Optical semiconductor deviceOZAKI TAKASHI·Filed 2011·Granted Jul 23, 2013·0 cites·9 claims
- 1050US2014057374A1Optical-semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1149US7641966B2Re-release adhesive and re-release adhesive sheetNITTO DENKO CORP·Filed 2001·Granted Jan 5, 2010·4 cites·5 claims
- 1249US2014106487A1Optical-semiconductor encapsulating materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1343US2011079816A1Optical-semiconductor encapsulating materialNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1439US2010209670A1Sheet for photosemiconductor encapsulationNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1536US2011079929A1Kit for optical semiconductor encapsulationNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →