Inventor · disambiguated record
Kousuke Azuma
Also filed as: AZUMA KOUSUKE
2 granted patents·1 pending application·95 citations·filing 1995–2000
68Inventor score
Files withNEC CORP3
Top patents by PatentIndex Score
3 records- 0181US5635220AMolding die for sealing semiconductor device with reduced resin burrsNEC CORP·Filed 1995·Granted Jun 3, 1997·52 cites·5 claims
- 0266US5766649AResin sealing mold die set with less resin remainder for semiconductor deviceNEC CORP·Filed 1996·Granted Jun 16, 1998·43 cites·13 claims
- 0329US2001002067A1Resin-encapsulated semiconductor device and method of forming the sameNEC CORP·Filed 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →