Inventor · disambiguated record
Kok Wai Chan
Also filed as: CHAN KOK WAI
8 granted patents·2 pending applications·3 citations·filing 2020–2023
72Inventor score
Files withIQM FINLAND OY10
Top patents by PatentIndex Score
10 records- 0191US11605586B2Airbridge for making connections on superconducting chip, and method for producing superconducting chips with airbridgesIQM FINLAND OY·Filed 2020·Granted Mar 14, 2023·3 cites·20 claims
- 0253US12074114B2Chip fabrication method and product including raised and recessed alignment structuresIQM FINLAND OY·Filed 2023·Granted Aug 27, 2024·0 cites·18 claims
- 0353US11907805B2Three-dimensional superconducting qubit and a method for manufacturing the sameIQM FINLAND OY·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 0452US12204995B2Method and arrangement for resetting qubitsIQM FINLAND OY·Filed 2020·Granted Jan 21, 2025·0 cites·17 claims
- 0550US12150388B2Electroplating for vertical interconnectionsIQM FINLAND OY·Filed 2022·Granted Nov 19, 2024·0 cites·14 claims
- 0649US11621388B2Method for manufacturing Josephson junctionsIQM FINLAND OY·Filed 2021·Granted Apr 4, 2023·0 cites·15 claims
- 0746US11849651B2Superconducting deviceIQM FINLAND OY·Filed 2022·Granted Dec 19, 2023·0 cites·15 claims
- 0844US2022359415A1Superconducting through substrate viasIQM FINLAND OY·Filed 2022·Application pending·0 cites
- 0942US12013323B2Sample cell for handling and measuring sensitive samples in low temperature conditionsIQM FINLAND OY·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 1041US2022012617A1Quantum computing circuit comprising a plurality of chips and method for manufacturing the sameIQM FINLAND OY·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →