Inventor · disambiguated record
Kok Yau Chua
Also filed as: Chua Kok Yau
17 granted patents·10 pending applications·23 citations·filing 2015–2024
88Inventor score
Top patents by PatentIndex Score
27 records- 0190US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0284US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0381US2025048531A1Power module with inductor-cooled power stageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0474US12150236B2Voltage regulator module with inductor-cooled power stageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Nov 19, 2024·0 cites·23 claims
- 0573US10631100B2Micro-electrical mechanical system sensor package and method of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 21, 2020·1 cites·28 claims
- 0671US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0768US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0860US2025062273A1Package with Vertical Electronic Components Held Together by a ClipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0960US2024343553A1Semiconductor package with floating metal portion and method for manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1059US2025226297A1Package with carrier having plated bottom surface and sidewallINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1157US12027436B2Package with clip having through hole accommodating component-related structureINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1257US2025140729A1Molded power package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1356US11174152B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 1456US10155657B2Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an openingINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·26 claims
- 1556US2024312936A1Power semiconductor package including a passive electronic component and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1655US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 1755US10304780B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 28, 2019·0 cites·10 claims
- 1854US2024162136A1Package for a lateral power transistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1952US2025054831A1Method for fabricating topside cooled semiconductor packages by film assisted molding and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2051US10501312B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2150US11289436B2Semiconductor package having a laser-activatable mold compoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 29, 2022·0 cites·13 claims
- 2250US10163812B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 25, 2018·0 cites·8 claims
- 2350US2022375883A1Method for Fabricating an Electrical Device Package Comprising Plateable Encapsulating LayersINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2449US12218038B2Leadframe, semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Feb 4, 2025·0 cites·20 claims
- 2549US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2648US11039231B2Package with acoustic sensing device(s) and millimeter wave sensing elementsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 15, 2021·0 cites·19 claims
- 2739US9868632B2Molded cavity package with embedded conductive layer and enhanced sealingINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 16, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →