Inventor · disambiguated record
Koji Eguchi
Also filed as: EGUCHI KOJI
15 granted patents·2 pending applications·323 citations·filing 1987–2004
94Inventor score
Files withMITSUBISHI ELECTRIC CORP11RENESAS TECH CORP2DENSO CORP1MATSUBISHI DENKI KABUSHIKI KAI1NIPPON DENSO CO1
Top patents by PatentIndex Score
17 records- 0190US6194907B1Prober and electric evaluation method of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Feb 27, 2001·110 cites·16 claims
- 0278US6748704B2Factory layoutRENESAS TECH CORP·Filed 2001·Granted Jun 15, 2004·31 cites·14 claims
- 0372US4859622AMethod of making a trench capacitor for dramMATSUBISHI DENKI KABUSHIKI KAI·Filed 1988·Granted Aug 22, 1989·28 cites·17 claims
- 0470US7016749B2System and method for product designing, and recording mediumTOYOTA MOTOR CO LTD·Filed 2002·Granted Mar 21, 2006·22 cites·25 claims
- 0567US5471084AMagnetoresistive element and manufacturing method thereforNIPPON DENSO CO·Filed 1992·Granted Nov 28, 1995·22 cites·8 claims
- 0657US5381029ASemiconductor device including semiconductor layer having impurity region and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jan 10, 1995·15 cites·3 claims
- 0756US5373192AElectromigration resistance metal interconnectMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Dec 13, 1994·21 cites·9 claims
- 0856US2003046192A1Distribution management system, distribution management method, and programMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 0955US5466638AMethod of manufacturing a metal interconnect with high resistance to electromigrationMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Nov 14, 1995·21 cites·6 claims
- 1051US6595428B2Process control device and process control method using a medium with rewritable marking techniqueMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 22, 2003·4 cites·20 claims
- 1151US4849854ASemiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Jul 18, 1989·11 cites·13 claims
- 1249US7298020B2Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2004·Granted Nov 20, 2007·6 cites·11 claims
- 1347US5200807AWiring connection structure for a semiconductor integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Apr 6, 1993·17 cites·18 claims
- 1440US5446301ASemiconductor device including semiconductor layer having impurity region and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 29, 1995·6 cites·2 claims
- 1538US6705450B2Clean room having an escalator, and method of transporting a semiconductor device thereinRENESAS TECH CORP·Filed 2001·Granted Mar 16, 2004·0 cites·11 claims
- 1636US5444186AMultilayer conductive wire for semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 22, 1995·9 cites·39 claims
- 1736US2002002409A1Product control method using wireless communicationMITSUBISHI ELECTRIC CORP·Filed 2000·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Koji Eguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →