Inventor · disambiguated record
Konika Ganguly
Also filed as: GANGULY KONIKA
8 granted patents·9 pending applications·2 citations·filing 2004–2022
73Inventor score
Top patents by PatentIndex Score
17 records- 0179US12040568B2Connector with staggered pin orientationINTEL CORP·Filed 2020·Granted Jul 16, 2024·1 cites·20 claims
- 0270US10467160B2Memory channel having more than one DIMM per motherboard DIMM connectorINTEL CORP·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 0364US12294167B2Closed loop compressed connector pinINTEL CORP·Filed 2021·Granted May 6, 2025·0 cites·14 claims
- 0453US12495497B2Low power memory moduleINTEL CORP·Filed 2022·Granted Dec 9, 2025·0 cites·18 claims
- 0553US12300918B2Memory module connector for thin computing systemsINTEL CORP·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 0650US2022361328A1Power conversion module using cmt connectorINTEL CORP·Filed 2022·Application pending·0 cites
- 0748US2022358072A1Memory module adapter card with multiplexer circuitryINTEL CORP·Filed 2022·Application pending·0 cites
- 0848US2022368047A1Adapter card with compression attached memory modulesINTEL CORP·Filed 2022·Application pending·0 cites
- 0948US2022353991A1Stackable memory module with double-sided compression contact padsINTEL CORP·Filed 2022·Application pending·0 cites
- 1048US2021328370A1Leaf spring for improved memory module that conserves motherboard wiring spaceINTEL CORP·Filed 2021·Application pending·0 cites
- 1147US2022360002A1Differential i/o card using cmt connectorINTEL CORP·Filed 2022·Application pending·0 cites
- 1246US2021183410A1Improved memory module that conserves motherboard wiring spaceINTEL CORP·Filed 2020·Application pending·0 cites
- 1344US2015234726A1Apparatus, system and method to provide platform support for multiple memory technologiesMORAN BRIAN P·Filed 2014·Application pending·0 cites
- 1444US2005201454A1System and method for automatically calibrating two-tap and multi-tap equalization for a communications linkINTEL CORP·Filed 2004·Application pending·0 cites
- 1541US10304814B2I/O layout footprint for multiple 1LM/2LM configurationsINTEL CORP·Filed 2017·Granted May 28, 2019·0 cites·19 claims
- 1639US12106818B2Power control of a memory device in connected standby stateINTEL CORP·Filed 2020·Granted Oct 1, 2024·0 cites·21 claims
- 1739US11295998B2Stiffener and package substrate for a semiconductor packageINTEL CORP·Filed 2018·Granted Apr 5, 2022·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →