Inventor · disambiguated record
Kozo Harada
Also filed as: HARADA KOZO
41 granted patents·8 pending applications·331 citations·filing 1980–2022
97Inventor score
Files withMITSUBISHI ELECTRIC CORP17RENESAS ELECTRONICS CORP14RENESAS TECH CORP7JFE STEEL CORP5NIPPON KOKAN KK4
Top patents by PatentIndex Score
49 records- 0197US7791204B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Sep 7, 2010·29 cites·17 claims
- 0294US7521799B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Apr 21, 2009·17 cites·6 claims
- 0394US6440584B1Hot-dip galvanized steel sheet and method for producing the sameNIPPON KOKAN KK·Filed 2001·Granted Aug 27, 2002·44 cites·18 claims
- 0493US6984885B1Semiconductor device having densely stacked semiconductor chipsRENESAS TECH CORP·Filed 2000·Granted Jan 10, 2006·93 cites·3 claims
- 0592US8314495B2Semiconductor device and method of manufacturing the sameHAYASHI EIJI·Filed 2012·Granted Nov 20, 2012·10 cites·12 claims
- 0691US7248366B2Method for marking defect and device thereforNIPPON KOKAN KK·Filed 2001·Granted Jul 24, 2007·20 cites·37 claims
- 0790US9831166B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 28, 2017·3 cites·14 claims
- 0890US8018066B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 13, 2011·6 cites·17 claims
- 0989US10714415B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Jul 14, 2020·2 cites·28 claims
- 1089US9576890B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 21, 2017·3 cites·7 claims
- 1189US8928147B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 6, 2015·4 cites·7 claims
- 1289US8822269B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·4 cites·8 claims
- 1384US7443036B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Oct 28, 2008·11 cites·10 claims
- 1483US8581410B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 12, 2013·2 cites·7 claims
- 1583US7423744B2Method for marking defect and device thereforNIPPON KOKAN KK·Filed 2006·Granted Sep 9, 2008·7 cites·16 claims
- 1677US8575757B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Nov 5, 2013·1 cites·6 claims
- 1775US4368572AMethod of manufacturing a shaft structure having a spherical bulbTOYO KOGYO CO·Filed 1980·Granted Jan 18, 1983·25 cites·3 claims
- 1873US10720368B2Semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 21, 2020·2 cites·10 claims
- 1971US7599052B2Method for marking defect and device thereforNIPPON KOKAN KK·Filed 2008·Granted Oct 6, 2009·2 cites·10 claims
- 2068US9299681B2Semiconductor device and method of manufacturingRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·3 claims
- 2168US6462425B1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 8, 2002·36 cites·14 claims
- 2266US10283444B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted May 7, 2019·0 cites·7 claims
- 2365US10468315B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Nov 5, 2019·1 cites·6 claims
- 2464US9496153B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 15, 2016·0 cites·3 claims
- 2563US8963327B2Semiconductor device including wiring board with semiconductor chipRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 24, 2015·1 cites·16 claims
- 2663US7745258B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Jun 29, 2010·2 cites·4 claims
- 2760US12233793B2Power conversion apparatus, electric power system for aircraft, and method of controlling power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 25, 2025·0 cites·18 claims
- 2860US2011269273A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2957US9920394B2Bake-hardening galvanized steel sheetJFE STEEL CORP·Filed 2014·Granted Mar 20, 2018·0 cites·4 claims
- 3057US7608156B2High strength cold rolled steel sheet and method for manufacturing the sameJFE STEEL CORP·Filed 2004·Granted Oct 27, 2009·2 cites·12 claims
- 3155US12469761B2Power module including highly-heat-dissipating insulation adhesive sheetMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Nov 11, 2025·0 cites·10 claims
- 3254US10494693B2High-strength steel sheet and method for producing the sameJFE STEEL CORP·Filed 2016·Granted Dec 3, 2019·0 cites·14 claims
- 3353US12224220B2Semiconductor module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 11, 2025·0 cites·13 claims
- 3453US10655194B2High-strength steel sheet and method for producing the sameJFE STEEL CORP·Filed 2016·Granted May 19, 2020·0 cites·17 claims
- 3552US2025364368A1Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3651US6982489B2Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetweenRENESAS TECH CORP·Filed 2003·Granted Jan 3, 2006·4 cites·2 claims
- 3750US10801085B2High-strength steel sheet and method for manufacturing the sameJFE STEEL CORP·Filed 2016·Granted Oct 13, 2020·0 cites·20 claims
- 3850US2025183233A1Power module semiconductor package and semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3946US2022415735A1Power module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 4045US11916001B2Semiconductor power module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 27, 2024·0 cites·15 claims
- 4145US2015118801A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4242US11855033B2Power semiconductor module and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 26, 2023·0 cites·15 claims
- 4342US2022336402A1Semiconductor device, power conversion device, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 4442US2024072026A1Semiconductor device, method of manufacturing same, and semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4541US10727145B2Semiconducter device with filler to suppress generation of air bubbles and electric power converterMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·0 cites·20 claims
- 4641US2005082663A1Semiconductor device and semiconductor moduleRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 4740US10461045B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 29, 2019·0 cites·15 claims
- 4839US11031355B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 8, 2021·0 cites·10 claims
- 4939US9627293B2Semiconductor device and heat-conductive sheetMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 18, 2017·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →