Inventor · disambiguated record
Kosuke Hareyama
Also filed as: HAREYAMA Kosuke
7 granted patents·5 pending applications·8 citations·filing 2013–2025
74Inventor score
Top patents by PatentIndex Score
12 records- 0184US12132061B2Semiconductor device, imaging device, and method of manufacturing semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Oct 29, 2024·2 cites·16 claims
- 0270US10187971B2Wiring board and method of manufacturing wiring boardSONY CORP·Filed 2013·Granted Jan 22, 2019·4 cites·11 claims
- 0368US11942495B2Semiconductor device, imaging apparatus, and method for manufacturing semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Mar 26, 2024·2 cites·26 claims
- 0458US2025311456A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0556US2025392801A1Semiconductor package, camera module, and cameraSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0653US2025311455A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0750US2025006755A1Semiconductor device and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 0849US2023420404A1Imaging element package, method of manufacturing the same, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 0948US12150383B2Thermoelectric power generation module and method of manufacturing thermoelectric power generation moduleSONY GROUP CORP·Filed 2021·Granted Nov 19, 2024·0 cites·6 claims
- 1039US10332826B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2014·Granted Jun 25, 2019·0 cites·2 claims
- 1138US10008458B2Semiconductor device capable of realizing impedance control and method of manufacturing the sameSONY CORP·Filed 2015·Granted Jun 26, 2018·0 cites·9 claims
- 1235US10580816B2Solid-state imaging device, camera module, and electronic apparatusSONY CORP·Filed 2015·Granted Mar 3, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →