Inventor · disambiguated record
Koji Hashizume
Also filed as: HASHIZUME KOJI
14 granted patents·4 pending applications·112 citations·filing 2000–2011
92Inventor score
Top patents by PatentIndex Score
18 records- 0187US6238283B1Double-sealed work conveying and transferring apparatus and container inspecting methodFUJITSU LTD·Filed 2000·Granted May 29, 2001·62 cites·10 claims
- 0285US7819165B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Oct 26, 2010·6 cites·4 claims
- 0384US7096911B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2001·Granted Aug 29, 2006·20 cites·49 claims
- 0481US7963308B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2006·Granted Jun 21, 2011·5 cites·23 claims
- 0579US8268113B2Apparatus and method for fabricating bonded substrateMURAMOTO TAKANORI·Filed 2011·Granted Sep 18, 2012·4 cites·4 claims
- 0677US7681522B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Mar 23, 2010·3 cites·17 claims
- 0776US7597774B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Oct 6, 2009·3 cites·4 claims
- 0873US7621310B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Nov 24, 2009·2 cites·9 claims
- 0973US7300532B2Method for manufacturing bonded substrateFUJITSU LTD·Filed 2005·Granted Nov 27, 2007·2 cites·13 claims
- 1071US7704348B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Apr 27, 2010·2 cites·1 claims
- 1156US7137427B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2003·Granted Nov 21, 2006·3 cites·9 claims
- 1253US7513966B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Apr 7, 2009·0 cites·13 claims
- 1352US8128768B2Apparatus for manufacturing bonded substrateHASHIZUME KOJI·Filed 2010·Granted Mar 6, 2012·0 cites·5 claims
- 1452US7703494B2Apparatus for manufacturing bonded substrateFUJITSU LTD·Filed 2006·Granted Apr 27, 2010·0 cites·3 claims
- 1551US2011011541A1Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1650US2010230030A1Apparatus and method for fabricating bonded substrateFUJITSU LTD KAWASAKI JAPAN·Filed 2010·Application pending·0 cites
- 1743US2006005920A1Method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1836US2003226633A1Method and apparatus for fabricating bonded substrateFUJITSU LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →